JPWO2022239105A1 - - Google Patents
Info
- Publication number
- JPWO2022239105A1 JPWO2022239105A1 JP2023520623A JP2023520623A JPWO2022239105A1 JP WO2022239105 A1 JPWO2022239105 A1 JP WO2022239105A1 JP 2023520623 A JP2023520623 A JP 2023520623A JP 2023520623 A JP2023520623 A JP 2023520623A JP WO2022239105 A1 JPWO2022239105 A1 JP WO2022239105A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Feeding Of Articles To Conveyors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/017864 WO2022239105A1 (ja) | 2021-05-11 | 2021-05-11 | 部品供給装置、および部品の供給方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022239105A1 true JPWO2022239105A1 (zh) | 2022-11-17 |
Family
ID=84028504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023520623A Pending JPWO2022239105A1 (zh) | 2021-05-11 | 2021-05-11 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2022239105A1 (zh) |
CN (1) | CN117204131A (zh) |
WO (1) | WO2022239105A1 (zh) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01176625U (zh) * | 1988-06-03 | 1989-12-15 | ||
JP3461629B2 (ja) * | 1995-08-21 | 2003-10-27 | 松下電器産業株式会社 | 部品供給装置 |
WO2002052588A1 (en) * | 2000-12-25 | 2002-07-04 | Hitachi, Ltd. | Semiconductor device, and method and apparatus for manufacturing semiconductor device |
JP6913768B2 (ja) * | 2018-01-11 | 2021-08-04 | 株式会社Fuji | スティックフィーダ |
-
2021
- 2021-05-11 JP JP2023520623A patent/JPWO2022239105A1/ja active Pending
- 2021-05-11 WO PCT/JP2021/017864 patent/WO2022239105A1/ja active Application Filing
- 2021-05-11 CN CN202180097543.8A patent/CN117204131A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2022239105A1 (ja) | 2022-11-17 |
CN117204131A (zh) | 2023-12-08 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240313 |