JPWO2022210419A1 - - Google Patents

Info

Publication number
JPWO2022210419A1
JPWO2022210419A1 JP2023511201A JP2023511201A JPWO2022210419A1 JP WO2022210419 A1 JPWO2022210419 A1 JP WO2022210419A1 JP 2023511201 A JP2023511201 A JP 2023511201A JP 2023511201 A JP2023511201 A JP 2023511201A JP WO2022210419 A1 JPWO2022210419 A1 JP WO2022210419A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023511201A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022210419A1 publication Critical patent/JPWO2022210419A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/10Arrangements for heating

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2023511201A 2021-03-31 2022-03-25 Pending JPWO2022210419A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021061339 2021-03-31
PCT/JP2022/014652 WO2022210419A1 (ja) 2021-03-31 2022-03-25 熱伝導性シートの製造方法

Publications (1)

Publication Number Publication Date
JPWO2022210419A1 true JPWO2022210419A1 (https=) 2022-10-06

Family

ID=83456230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023511201A Pending JPWO2022210419A1 (https=) 2021-03-31 2022-03-25

Country Status (3)

Country Link
JP (1) JPWO2022210419A1 (https=)
TW (1) TW202248310A (https=)
WO (1) WO2022210419A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114833044B (zh) * 2022-04-24 2023-01-13 浙江大学 一种高导热植绒垫的自动化生产装置
JP7720491B1 (ja) * 2023-09-27 2025-08-07 バンドー化学株式会社 熱伝導性シート

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017135137A (ja) * 2016-01-25 2017-08-03 東洋紡株式会社 絶縁高熱伝導性シート、およびその製法、および積層体
WO2018143189A1 (ja) * 2017-02-02 2018-08-09 株式会社カネカ 層間熱接合部材、層間熱接合方法、層間熱接合部材の製造方法
WO2020067141A1 (ja) * 2018-09-26 2020-04-02 積水ポリマテック株式会社 熱伝導性シート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017135137A (ja) * 2016-01-25 2017-08-03 東洋紡株式会社 絶縁高熱伝導性シート、およびその製法、および積層体
WO2018143189A1 (ja) * 2017-02-02 2018-08-09 株式会社カネカ 層間熱接合部材、層間熱接合方法、層間熱接合部材の製造方法
WO2020067141A1 (ja) * 2018-09-26 2020-04-02 積水ポリマテック株式会社 熱伝導性シート

Also Published As

Publication number Publication date
TW202248310A (zh) 2022-12-16
WO2022210419A1 (ja) 2022-10-06

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