JPWO2022209930A5 - - Google Patents

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JPWO2022209930A5
JPWO2022209930A5 JP2023510928A JP2023510928A JPWO2022209930A5 JP WO2022209930 A5 JPWO2022209930 A5 JP WO2022209930A5 JP 2023510928 A JP2023510928 A JP 2023510928A JP 2023510928 A JP2023510928 A JP 2023510928A JP WO2022209930 A5 JPWO2022209930 A5 JP WO2022209930A5
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Japan
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patent application
japanese patent
application publication
publication
japanese
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JP2023510928A
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Japanese (ja)
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JP7398623B2 (ja
JPWO2022209930A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
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Priority claimed from PCT/JP2022/012128 external-priority patent/WO2022209930A1/ja
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Publication of JPWO2022209930A5 publication Critical patent/JPWO2022209930A5/ja
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Publication of JP7398623B2 publication Critical patent/JP7398623B2/ja
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JP2023510928A 2021-04-02 2022-03-17 レーザ加工ヘッド及びこれを備えたレーザ加工システム Active JP7398623B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021063722 2021-04-02
JP2021063722 2021-04-02
PCT/JP2022/012128 WO2022209930A1 (ja) 2021-04-02 2022-03-17 レーザ加工ヘッド及びこれを備えたレーザ加工システム

Publications (3)

Publication Number Publication Date
JPWO2022209930A1 JPWO2022209930A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2022-10-06
JPWO2022209930A5 true JPWO2022209930A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2023-10-20
JP7398623B2 JP7398623B2 (ja) 2023-12-15

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ID=83459110

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JP2023510928A Active JP7398623B2 (ja) 2021-04-02 2022-03-17 レーザ加工ヘッド及びこれを備えたレーザ加工システム

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US (1) US20230415260A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP4316725B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP7398623B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN117120207A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO2022209930A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117047261B (zh) * 2023-09-04 2025-06-27 深圳公大激光有限公司 一种环形斑激光加工系统

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10296468A (ja) * 1997-04-24 1998-11-10 Nikon Corp レーザ加工装置
JP2001018086A (ja) * 1999-07-01 2001-01-23 Nec Corp レーザ加工装置および方法
JP5033693B2 (ja) 2008-03-25 2012-09-26 株式会社アマダ ファイバレーザ加工機における集光直径の変換制御方法及びその装置
JP5802109B2 (ja) * 2011-10-26 2015-10-28 浜松ホトニクス株式会社 光変調制御方法、制御プログラム、制御装置、及びレーザ光照射装置
JP5909463B2 (ja) 2013-05-27 2016-04-26 京楽産業.株式会社 遊技機
CN109982808B (zh) * 2016-11-22 2021-04-13 松下知识产权经营株式会社 激光加工装置以及激光加工方法
DE102018128266A1 (de) * 2018-11-12 2020-05-14 Eos Gmbh Electro Optical Systems Verfahren und Vorrichtung zum Bestrahlen eines Materials mit einem Energiestrahl
DE102019109795B4 (de) * 2019-04-12 2023-11-30 Precitec Gmbh & Co. Kg Vorrichtung und Verfahren zum Bestimmen einer Fokuslage sowie zugehöriger Laserbearbeitungskopf
JP2020199517A (ja) * 2019-06-07 2020-12-17 ファナック株式会社 レーザ加工システム

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