JPWO2022209714A5 - - Google Patents
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- JPWO2022209714A5 JPWO2022209714A5 JP2023510800A JP2023510800A JPWO2022209714A5 JP WO2022209714 A5 JPWO2022209714 A5 JP WO2022209714A5 JP 2023510800 A JP2023510800 A JP 2023510800A JP 2023510800 A JP2023510800 A JP 2023510800A JP WO2022209714 A5 JPWO2022209714 A5 JP WO2022209714A5
- Authority
- JP
- Japan
- Prior art keywords
- rfid module
- container
- module according
- metal layer
- slot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Claims (8)
樹脂製の基材と、前記基材上に形成された金属層と、を有する包装材と、
包装材の周縁部が互いに接合されたシール部の内側に内容物を収容する収容部と、
前記シール部に形成されたスロットと、を備え、
前記RFIDモジュールは、RFIC素子と、通信周波数である固有の共振周波数の電磁波による電流を前記RFIC素子に伝送するフィルタ回路と、前記フィルタ回路と接続する第１及び第２電極と、
前記シール部に形成された貫通孔と、を備え、
RFIDモジュールの前記第１電極と前記金属層とが電気的に接続され、
RFIDモジュールが前記スロットを跨いで前記RFIDモジュールの前記第２電極と前記金属層とが電気的に接続され、
前記スロットと前記貫通孔とが一体的に形成されている、
RFIDモジュールを備えた容器。 A container with an RFID module,
A packaging material having a resin substrate and a metal layer formed on the substrate;
an accommodating portion for accommodating contents inside a sealed portion in which the peripheral edge portions of the packaging material are joined to each other;
a slot formed in the seal,
The RFID module includes an RFIC element, a filter circuit that transmits a current due to electromagnetic waves having a unique resonance frequency, which is a communication frequency, to the RFIC element, first and second electrodes that are connected to the filter circuit ,
and a through hole formed in the seal portion,
the first electrode and the metal layer of the RFID module are electrically connected;
the second electrode of the RFID module and the metal layer are electrically connected across the slot by the RFID module ;
wherein the slot and the through hole are integrally formed;
Container with RFID module.
請求項１に記載のRFIDモジュールを備えた容器。 When the metal layer is irradiated with an electromagnetic wave having a communication frequency, a current flows in a direction circulating the slot.
A container provided with the RFID module according to claim 1 .
請求項１または２に記載のRFIDモジュールを備えた容器。 the length of the slot has a physical length of one-half wavelength of an electromagnetic wave at a communication frequency;
A container comprising the RFID module according to claim 1 or 2 .
請求項１から３のいずれか１つに記載のRFIDモジュールを備えた容器。 wherein the filter circuit is an LC parallel resonant circuit,
A container provided with the RFID module according to any one of claims 1 to 3 .
前記コイルは、保護層で覆われている、
請求項４に記載のRFIDモジュールを備えた容器。 The filter circuit has a coil formed on a substrate,
the coil is covered with a protective layer;
A container comprising the RFID module according to claim 4 .
請求項５に記載のRFIDモジュールを備えた容器。 the coil of the filter circuit has a figure eight shape;
A container comprising the RFID module according to claim 5 .
請求項１から６のいずれか１つに記載のRFIDモジュールを備えた容器。 The sheet resistance of the metal layer is 0.5Ω/□ or more.
A container provided with an RFID module according to any one of claims 1 to 6 .
請求項７に記載のRFIDモジュールを備えた容器。 The thickness of the metal layer is 1 nm or more and 1 μm or less.
A container provided with the RFID module according to claim 7 .
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021062879 | 2021-04-01 | ||
| JP2021062879 | 2021-04-01 | ||
| PCT/JP2022/010700 WO2022209714A1 (en) | 2021-04-01 | 2022-03-10 | Container provided with rfid module |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022209714A1 JPWO2022209714A1 (en) | 2022-10-06 |
| JPWO2022209714A5 true JPWO2022209714A5 (en) | 2023-06-02 |
| JP7294562B2 JP7294562B2 (en) | 2023-06-20 |
Family
ID=83456082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023510800A Active JP7294562B2 (en) | 2021-04-01 | 2022-03-10 | Container with RFID module |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7294562B2 (en) |
| WO (1) | WO2022209714A1 (en) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI446269B (en) | 2009-12-03 | 2014-07-21 | Ind Tech Res Inst | Wireless communication apparatus |
| TWI433389B (en) | 2010-04-22 | 2014-04-01 | Taiwan Lamination Ind Inc | Packaging bag with radio frequency identification capability and its manufacturing method |
| CN102372120B (en) * | 2010-08-16 | 2015-04-15 | 酷标物联科技无锡有限公司 | Metal foil paper capable of being used as RFID label |
| CN104081676B (en) * | 2012-04-18 | 2016-12-21 | 株式会社村田制作所 | Communicator |
| KR20160030554A (en) * | 2013-08-09 | 2016-03-18 | 가부시키가이샤 리코 | Package with radio ic tag and method for manufacturing package with radio ic tag |
| JP2015060260A (en) * | 2013-09-17 | 2015-03-30 | 株式会社リコー | Communication device, communication system, and method of using communication device |
| CN110350296B (en) * | 2014-11-27 | 2021-01-05 | 株式会社村田制作所 | RFIC module and RFID tag provided with the same |
| JP7091920B2 (en) * | 2018-08-03 | 2022-06-28 | 大日本印刷株式会社 | Package with RF tag |
| JP6787538B1 (en) * | 2019-07-31 | 2020-11-18 | 株式会社村田製作所 | RFIC module and RFID tag |
-
2022
- 2022-03-10 JP JP2023510800A patent/JP7294562B2/en active Active
- 2022-03-10 WO PCT/JP2022/010700 patent/WO2022209714A1/en active Application Filing
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