JPWO2022202941A1 - - Google Patents

Info

Publication number
JPWO2022202941A1
JPWO2022202941A1 JP2023509270A JP2023509270A JPWO2022202941A1 JP WO2022202941 A1 JPWO2022202941 A1 JP WO2022202941A1 JP 2023509270 A JP2023509270 A JP 2023509270A JP 2023509270 A JP2023509270 A JP 2023509270A JP WO2022202941 A1 JPWO2022202941 A1 JP WO2022202941A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023509270A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022202941A1 publication Critical patent/JPWO2022202941A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0605—Carbon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G01N27/30—Electrodes, e.g. test electrodes; Half-cells
    • G01N27/308—Electrodes, e.g. test electrodes; Half-cells at least partially made of carbon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Electrochemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Plasma & Fusion (AREA)
  • Physical Vapour Deposition (AREA)
JP2023509270A 2021-03-23 2022-03-23 Pending JPWO2022202941A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021048725 2021-03-23
PCT/JP2022/013729 WO2022202941A1 (ja) 2021-03-23 2022-03-23 電極およびその製造方法
JP2022046632 2022-03-23

Publications (1)

Publication Number Publication Date
JPWO2022202941A1 true JPWO2022202941A1 (https=) 2022-09-29

Family

ID=83395777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023509270A Pending JPWO2022202941A1 (https=) 2021-03-23 2022-03-23

Country Status (3)

Country Link
US (1) US12344928B2 (https=)
JP (1) JPWO2022202941A1 (https=)
WO (1) WO2022202941A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116134306A (zh) * 2020-07-22 2023-05-16 日东电工株式会社 电极
WO2025182769A1 (ja) * 2024-02-28 2025-09-04 日東電工株式会社 電極、バイオセンサーおよび電極の製造方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02133593A (ja) * 1988-11-11 1990-05-22 Mitsui Eng & Shipbuild Co Ltd 炭素質電極
JP2005310995A (ja) * 2004-04-20 2005-11-04 Mitsubishi Gas Chem Co Inc 電気二重層キャパシタ電極用炭素材料およびその製造法
JP2011109942A (ja) * 2009-11-25 2011-06-09 Mitsui Eng & Shipbuild Co Ltd 生化学反応用炭素電極
JP2012112031A (ja) * 2010-11-05 2012-06-14 Nitto Denko Corp 透明導電性フィルムの製造方法
JP2017122261A (ja) * 2016-01-06 2017-07-13 株式会社アルバック 成膜方法
JP2017193780A (ja) * 2014-04-30 2017-10-26 日東電工株式会社 透明導電性フィルム及びその製造方法
JP2018123420A (ja) * 2016-06-06 2018-08-09 株式会社半導体エネルギー研究所 スパッタリング装置、スパッタリングターゲット、及び当該スパッタリング装置を用いた半導体膜の作製方法
JP2018155728A (ja) * 2017-03-15 2018-10-04 学校法人東京理科大学 導電性ダイヤモンドライクカーボンマイクロ電極
JP2019105637A (ja) * 2017-12-11 2019-06-27 日東電工株式会社 電極フィルムおよび電気化学測定システム
JP2020144116A (ja) * 2019-02-28 2020-09-10 日東電工株式会社 電極および電気化学測定システム
JP2021056205A (ja) * 2019-03-28 2021-04-08 日東電工株式会社 電極および電気化学測定システム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1061472C (zh) * 1996-12-25 2001-01-31 中国科学院化学研究所 锂二次电池碳负极材料及其制备方法
GB201203219D0 (en) * 2012-02-24 2012-04-11 Teer Coatings Ltd Coating with conductive and corrosion resistance characteristics
CN105874545B (zh) * 2014-03-31 2017-07-21 株式会社钟化 透明导电膜的制造方法
US10605760B2 (en) 2014-07-22 2020-03-31 Toyobo Co., Ltd. Thin film-laminated film

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02133593A (ja) * 1988-11-11 1990-05-22 Mitsui Eng & Shipbuild Co Ltd 炭素質電極
JP2005310995A (ja) * 2004-04-20 2005-11-04 Mitsubishi Gas Chem Co Inc 電気二重層キャパシタ電極用炭素材料およびその製造法
JP2011109942A (ja) * 2009-11-25 2011-06-09 Mitsui Eng & Shipbuild Co Ltd 生化学反応用炭素電極
JP2012112031A (ja) * 2010-11-05 2012-06-14 Nitto Denko Corp 透明導電性フィルムの製造方法
JP2017193780A (ja) * 2014-04-30 2017-10-26 日東電工株式会社 透明導電性フィルム及びその製造方法
JP2017122261A (ja) * 2016-01-06 2017-07-13 株式会社アルバック 成膜方法
JP2018123420A (ja) * 2016-06-06 2018-08-09 株式会社半導体エネルギー研究所 スパッタリング装置、スパッタリングターゲット、及び当該スパッタリング装置を用いた半導体膜の作製方法
JP2018155728A (ja) * 2017-03-15 2018-10-04 学校法人東京理科大学 導電性ダイヤモンドライクカーボンマイクロ電極
JP2019105637A (ja) * 2017-12-11 2019-06-27 日東電工株式会社 電極フィルムおよび電気化学測定システム
JP2020144116A (ja) * 2019-02-28 2020-09-10 日東電工株式会社 電極および電気化学測定システム
JP2021056205A (ja) * 2019-03-28 2021-04-08 日東電工株式会社 電極および電気化学測定システム

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
TAKEMOTO, MITSUNOBU ET AL.: "Controlling Surface Oxygen Concentration of a Nanocarbon Film Electrode for Improvement of Target A", ANALYTICAL SCIENCE APRIL, vol. 36, JPN6022020863, 2020, pages 441 - 446, ISSN: 0005812910 *

Also Published As

Publication number Publication date
US12344928B2 (en) 2025-07-01
US20240167146A1 (en) 2024-05-23
WO2022202941A1 (ja) 2022-09-29

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