JPWO2022202804A1 - - Google Patents

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Publication number
JPWO2022202804A1
JPWO2022202804A1 JP2023509190A JP2023509190A JPWO2022202804A1 JP WO2022202804 A1 JPWO2022202804 A1 JP WO2022202804A1 JP 2023509190 A JP2023509190 A JP 2023509190A JP 2023509190 A JP2023509190 A JP 2023509190A JP WO2022202804 A1 JPWO2022202804 A1 JP WO2022202804A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023509190A
Other languages
Japanese (ja)
Other versions
JPWO2022202804A5 (en
JP7351434B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2022202804A1 publication Critical patent/JPWO2022202804A1/ja
Publication of JPWO2022202804A5 publication Critical patent/JPWO2022202804A5/ja
Priority to JP2023142704A priority Critical patent/JP2023164926A/en
Application granted granted Critical
Publication of JP7351434B2 publication Critical patent/JP7351434B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/16—Dielectric waveguides, i.e. without a longitudinal conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
JP2023509190A 2021-03-25 2022-03-22 Thermosetting resin composition, dielectric substrate, and microstrip antenna Active JP7351434B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023142704A JP2023164926A (en) 2021-03-25 2023-09-04 Thermosetting resin composition, dielectric substrate, and microstrip antenna

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
JP2021051748 2021-03-25
JP2021051748 2021-03-25
JP2021172197 2021-10-21
JP2021172197 2021-10-21
JP2021197731 2021-12-06
JP2021197667 2021-12-06
JP2021197669 2021-12-06
JP2021197720 2021-12-06
JP2021197667 2021-12-06
JP2021197679 2021-12-06
JP2021197679 2021-12-06
JP2021197669 2021-12-06
JP2021197720 2021-12-06
JP2021197731 2021-12-06
PCT/JP2022/013123 WO2022202804A1 (en) 2021-03-25 2022-03-22 Thermosetting resin composition, dielectric substrate, and microstrip antenna

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023142704A Division JP2023164926A (en) 2021-03-25 2023-09-04 Thermosetting resin composition, dielectric substrate, and microstrip antenna

Publications (3)

Publication Number Publication Date
JPWO2022202804A1 true JPWO2022202804A1 (en) 2022-09-29
JPWO2022202804A5 JPWO2022202804A5 (en) 2023-08-18
JP7351434B2 JP7351434B2 (en) 2023-09-27

Family

ID=83395876

Family Applications (6)

Application Number Title Priority Date Filing Date
JP2023509181A Active JP7396534B2 (en) 2021-03-25 2022-03-22 Thermosetting resin compositions, high frequency devices, dielectric substrates, and microstrip antennas
JP2023509187A Active JP7347713B2 (en) 2021-03-25 2022-03-22 Thermosetting resin compositions, high frequency devices, dielectric substrates, and microstrip antennas
JP2023509190A Active JP7351434B2 (en) 2021-03-25 2022-03-22 Thermosetting resin composition, dielectric substrate, and microstrip antenna
JP2023135283A Pending JP2023179419A (en) 2021-03-25 2023-08-23 Heat curable resin composition, high-frequency device, dielectric substrate, and micro strip antenna
JP2023142704A Pending JP2023164926A (en) 2021-03-25 2023-09-04 Thermosetting resin composition, dielectric substrate, and microstrip antenna
JP2023192059A Pending JP2024014929A (en) 2021-03-25 2023-11-10 Thermosetting resin compositions, high frequency devices, dielectric substrates, and microstrip antennas

Family Applications Before (2)

Application Number Title Priority Date Filing Date
JP2023509181A Active JP7396534B2 (en) 2021-03-25 2022-03-22 Thermosetting resin compositions, high frequency devices, dielectric substrates, and microstrip antennas
JP2023509187A Active JP7347713B2 (en) 2021-03-25 2022-03-22 Thermosetting resin compositions, high frequency devices, dielectric substrates, and microstrip antennas

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2023135283A Pending JP2023179419A (en) 2021-03-25 2023-08-23 Heat curable resin composition, high-frequency device, dielectric substrate, and micro strip antenna
JP2023142704A Pending JP2023164926A (en) 2021-03-25 2023-09-04 Thermosetting resin composition, dielectric substrate, and microstrip antenna
JP2023192059A Pending JP2024014929A (en) 2021-03-25 2023-11-10 Thermosetting resin compositions, high frequency devices, dielectric substrates, and microstrip antennas

Country Status (4)

Country Link
JP (6) JP7396534B2 (en)
KR (3) KR20230160342A (en)
TW (3) TW202248273A (en)
WO (3) WO2022202792A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023145327A1 (en) * 2022-01-26 2023-08-03 株式会社レゾナック Thermosetting resin composition, prepreg, resin film, laminate, printed wiring board, antenna device, antenna module and communication device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07241853A (en) * 1994-03-08 1995-09-19 Kinugawa Rubber Ind Co Ltd Induction heating mold
JP2004124066A (en) * 2002-08-07 2004-04-22 Toray Ind Inc High dielectric composition
JP3680854B2 (en) * 2003-04-04 2005-08-10 東レ株式会社 Paste composition and dielectric composition using the same
JP2004315653A (en) 2003-04-16 2004-11-11 Hitachi Chem Co Ltd Resin composition and its use
JP2008106106A (en) 2006-10-24 2008-05-08 Hitachi Chem Co Ltd Resin composition having high permittivity, prepreg and laminated plate used for printed wiring board
CN103351578B (en) * 2013-07-19 2015-08-19 广东生益科技股份有限公司 Resin combination of a kind of medium layer of the medium substrate for the formation of antenna and uses thereof
JP6066865B2 (en) * 2013-08-15 2017-01-25 信越化学工業株式会社 High dielectric constant epoxy resin composition and semiconductor device
TWI506077B (en) * 2013-12-31 2015-11-01 Taiwan Union Technology Corp Resin composition and uses of the same
JP2018041998A (en) 2015-01-28 2018-03-15 日本化薬株式会社 Antenna and electronic device including the same
JP7067576B2 (en) 2020-02-21 2022-05-16 味の素株式会社 Resin composition
JP6870778B1 (en) 2020-12-11 2021-05-12 昭和電工マテリアルズ株式会社 Resin composition for molding and electronic component equipment

Also Published As

Publication number Publication date
JP7347713B2 (en) 2023-09-20
WO2022202781A1 (en) 2022-09-29
TW202248340A (en) 2022-12-16
JPWO2022202792A1 (en) 2022-09-29
KR20230161473A (en) 2023-11-27
JP2024014929A (en) 2024-02-01
TW202248273A (en) 2022-12-16
TW202248274A (en) 2022-12-16
WO2022202804A1 (en) 2022-09-29
JP7351434B2 (en) 2023-09-27
JPWO2022202781A1 (en) 2022-09-29
KR20230160869A (en) 2023-11-24
JP2023179419A (en) 2023-12-19
JP7396534B2 (en) 2023-12-12
KR20230160342A (en) 2023-11-23
WO2022202792A1 (en) 2022-09-29
JP2023164926A (en) 2023-11-14

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