JPWO2022202541A1 - - Google Patents

Info

Publication number
JPWO2022202541A1
JPWO2022202541A1 JP2023509069A JP2023509069A JPWO2022202541A1 JP WO2022202541 A1 JPWO2022202541 A1 JP WO2022202541A1 JP 2023509069 A JP2023509069 A JP 2023509069A JP 2023509069 A JP2023509069 A JP 2023509069A JP WO2022202541 A1 JPWO2022202541 A1 JP WO2022202541A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023509069A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022202541A1 publication Critical patent/JPWO2022202541A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2023509069A 2021-03-26 2022-03-16 Pending JPWO2022202541A1 (cs)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021053818 2021-03-26
PCT/JP2022/011925 WO2022202541A1 (ja) 2021-03-26 2022-03-16 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Publications (1)

Publication Number Publication Date
JPWO2022202541A1 true JPWO2022202541A1 (cs) 2022-09-29

Family

ID=83397213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023509069A Pending JPWO2022202541A1 (cs) 2021-03-26 2022-03-16

Country Status (5)

Country Link
JP (1) JPWO2022202541A1 (cs)
KR (1) KR20230160813A (cs)
CN (1) CN116997683A (cs)
TW (1) TW202305188A (cs)
WO (1) WO2022202541A1 (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115652384A (zh) * 2022-11-07 2023-01-31 九江德福科技股份有限公司 一种特殊粗化形貌电解铜箔及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107881505A (zh) * 2013-02-14 2018-04-06 三井金属矿业株式会社 表面处理铜箔及用表面处理铜箔得到的覆铜层压板
MY181562A (en) 2013-02-28 2020-12-29 Mitsui Mining & Smelting Co Ltd Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board
MY182166A (en) * 2013-09-20 2021-01-18 Namics Corp Copper foil, copper foil with carrier foil, and copper-clad laminate
WO2016174998A1 (ja) 2015-04-28 2016-11-03 三井金属鉱業株式会社 粗化処理銅箔及びプリント配線板
JP6945523B2 (ja) * 2016-04-14 2021-10-06 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
CN110088361B (zh) * 2016-12-14 2021-07-16 古河电气工业株式会社 表面处理铜箔以及覆铜层叠板
JP7492808B2 (ja) * 2017-03-31 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7114499B2 (ja) * 2019-01-30 2022-08-08 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
TW202305188A (zh) 2023-02-01
KR20230160813A (ko) 2023-11-24
WO2022202541A1 (ja) 2022-09-29
CN116997683A (zh) 2023-11-03

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Legal Events

Date Code Title Description
A621 Written request for application examination

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Effective date: 20250107