JPWO2022201857A1 - - Google Patents

Info

Publication number
JPWO2022201857A1
JPWO2022201857A1 JP2023508726A JP2023508726A JPWO2022201857A1 JP WO2022201857 A1 JPWO2022201857 A1 JP WO2022201857A1 JP 2023508726 A JP2023508726 A JP 2023508726A JP 2023508726 A JP2023508726 A JP 2023508726A JP WO2022201857 A1 JPWO2022201857 A1 JP WO2022201857A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023508726A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022201857A1 publication Critical patent/JPWO2022201857A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
JP2023508726A 2021-03-25 2022-01-28 Pending JPWO2022201857A1 (enrdf_load_html_response)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021052064 2021-03-25
JP2021151207 2021-09-16
PCT/JP2022/003425 WO2022201857A1 (ja) 2021-03-25 2022-01-28 表面保護シートおよび処理方法

Publications (1)

Publication Number Publication Date
JPWO2022201857A1 true JPWO2022201857A1 (enrdf_load_html_response) 2022-09-29

Family

ID=83396767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023508726A Pending JPWO2022201857A1 (enrdf_load_html_response) 2021-03-25 2022-01-28

Country Status (3)

Country Link
JP (1) JPWO2022201857A1 (enrdf_load_html_response)
TW (1) TW202300608A (enrdf_load_html_response)
WO (1) WO2022201857A1 (enrdf_load_html_response)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0365998A2 (en) * 1988-10-26 1990-05-02 Kimberly-Clark Corporation Water releasable pressure sensitive adhesive sheet material
JPH06207149A (ja) * 1992-11-03 1994-07-26 Rohm & Haas Co 支持体層、感圧接着剤層および水性剥離被覆層から成る物品
JP2012514104A (ja) * 2008-12-31 2012-06-21 スリーエム イノベイティブ プロパティズ カンパニー 引き伸ばし剥離可能な接着テープ
WO2019151194A1 (ja) * 2018-02-05 2019-08-08 日東電工株式会社 粘着シートおよび粘着シート剥離方法
WO2021024741A1 (ja) * 2019-08-02 2021-02-11 日東電工株式会社 積層体および剥離方法
WO2021024864A1 (ja) * 2019-08-02 2021-02-11 日東電工株式会社 粘着シート

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006241264A (ja) * 2005-03-02 2006-09-14 Kuramoto Sangyo:Kk 粘着組成物及びそれを用いた温水剥離型粘着シート

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0365998A2 (en) * 1988-10-26 1990-05-02 Kimberly-Clark Corporation Water releasable pressure sensitive adhesive sheet material
JPH06207149A (ja) * 1992-11-03 1994-07-26 Rohm & Haas Co 支持体層、感圧接着剤層および水性剥離被覆層から成る物品
JP2012514104A (ja) * 2008-12-31 2012-06-21 スリーエム イノベイティブ プロパティズ カンパニー 引き伸ばし剥離可能な接着テープ
WO2019151194A1 (ja) * 2018-02-05 2019-08-08 日東電工株式会社 粘着シートおよび粘着シート剥離方法
WO2021024741A1 (ja) * 2019-08-02 2021-02-11 日東電工株式会社 積層体および剥離方法
WO2021024864A1 (ja) * 2019-08-02 2021-02-11 日東電工株式会社 粘着シート

Also Published As

Publication number Publication date
WO2022201857A1 (ja) 2022-09-29
TW202300608A (zh) 2023-01-01

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Effective date: 20241107

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