JPWO2022196066A1 - - Google Patents
Info
- Publication number
- JPWO2022196066A1 JPWO2022196066A1 JP2023506788A JP2023506788A JPWO2022196066A1 JP WO2022196066 A1 JPWO2022196066 A1 JP WO2022196066A1 JP 2023506788 A JP2023506788 A JP 2023506788A JP 2023506788 A JP2023506788 A JP 2023506788A JP WO2022196066 A1 JPWO2022196066 A1 JP WO2022196066A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021044791 | 2021-03-18 | ||
PCT/JP2022/001280 WO2022196066A1 (ja) | 2021-03-18 | 2022-01-17 | 電子機器の放熱構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022196066A1 true JPWO2022196066A1 (ja) | 2022-09-22 |
JPWO2022196066A5 JPWO2022196066A5 (ja) | 2023-11-15 |
Family
ID=83320206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023506788A Pending JPWO2022196066A1 (ja) | 2021-03-18 | 2022-01-17 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20240170365A1 (ja) |
JP (1) | JPWO2022196066A1 (ja) |
DE (1) | DE112022000509T5 (ja) |
WO (1) | WO2022196066A1 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005311230A (ja) * | 2004-04-26 | 2005-11-04 | Murata Mfg Co Ltd | 回路モジュールおよびこの回路モジュールを用いた回路装置 |
JP2007242964A (ja) * | 2006-03-09 | 2007-09-20 | Toshiba Corp | 締着装置 |
JP2014170834A (ja) * | 2013-03-04 | 2014-09-18 | Mitsubishi Electric Corp | パワー半導体の放熱構造およびこれを用いたオーディオ装置 |
JP2019096746A (ja) | 2017-11-23 | 2019-06-20 | 株式会社デンソー | 電子装置 |
TWI717831B (zh) | 2019-09-11 | 2021-02-01 | 財團法人資訊工業策進會 | 攻擊路徑偵測方法、攻擊路徑偵測系統及非暫態電腦可讀取媒體 |
-
2022
- 2022-01-17 DE DE112022000509.2T patent/DE112022000509T5/de active Pending
- 2022-01-17 JP JP2023506788A patent/JPWO2022196066A1/ja active Pending
- 2022-01-17 US US18/281,672 patent/US20240170365A1/en active Pending
- 2022-01-17 WO PCT/JP2022/001280 patent/WO2022196066A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2022196066A1 (ja) | 2022-09-22 |
DE112022000509T5 (de) | 2023-12-07 |
US20240170365A1 (en) | 2024-05-23 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230822 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230822 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240514 |