JPWO2022191063A1 - - Google Patents

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Publication number
JPWO2022191063A1
JPWO2022191063A1 JP2022546560A JP2022546560A JPWO2022191063A1 JP WO2022191063 A1 JPWO2022191063 A1 JP WO2022191063A1 JP 2022546560 A JP2022546560 A JP 2022546560A JP 2022546560 A JP2022546560 A JP 2022546560A JP WO2022191063 A1 JPWO2022191063 A1 JP WO2022191063A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022546560A
Other versions
JP7219372B2 (ja
JPWO2022191063A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022191063A1 publication Critical patent/JPWO2022191063A1/ja
Application granted granted Critical
Publication of JP7219372B2 publication Critical patent/JP7219372B2/ja
Publication of JPWO2022191063A5 publication Critical patent/JPWO2022191063A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/43—Thickening agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83909—Post-treatment of the layer connector or bonding area
    • H01L2224/83951—Forming additional members, e.g. for reinforcing, fillet sealant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Paints Or Removers (AREA)
JP2022546560A 2021-03-11 2022-03-04 コーティング剤作製キット、コーティング剤、電子基板及び電子部品モジュールの製造方法 Active JP7219372B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021039341 2021-03-11
JP2021039341 2021-03-11
JP2022018377 2022-02-09
JP2022018377 2022-02-09
PCT/JP2022/009377 WO2022191063A1 (ja) 2021-03-11 2022-03-04 コーティング剤作製キット、コーティング剤、電子基板及び電子部品モジュールの製造方法

Publications (3)

Publication Number Publication Date
JPWO2022191063A1 true JPWO2022191063A1 (ja) 2022-09-15
JP7219372B2 JP7219372B2 (ja) 2023-02-07
JPWO2022191063A5 JPWO2022191063A5 (ja) 2023-02-07

Family

ID=83227826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022546560A Active JP7219372B2 (ja) 2021-03-11 2022-03-04 コーティング剤作製キット、コーティング剤、電子基板及び電子部品モジュールの製造方法

Country Status (4)

Country Link
US (1) US20240141183A1 (ja)
EP (1) EP4306603A1 (ja)
JP (1) JP7219372B2 (ja)
WO (1) WO2022191063A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024070548A1 (ja) * 2022-09-28 2024-04-04 積水化学工業株式会社 コーティング剤及び電子部品モジュールの製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0584775A (ja) * 1991-09-27 1993-04-06 Sekisui Chem Co Ltd 射出成形品の製造方法
JPH09185333A (ja) * 1996-01-04 1997-07-15 Toppan Printing Co Ltd 磁気可視記録媒体の製造方法及び磁気可視記録媒体
JP2001131552A (ja) * 1999-08-03 2001-05-15 Ishizuka Glass Co Ltd 難燃性付与用複合粒子
JP2003246009A (ja) * 2001-12-21 2003-09-02 Taisei Plas Co Ltd 金属と熱可塑性組成物の複合体とその製造方法
JP2011075786A (ja) * 2009-09-30 2011-04-14 Sekisui Chem Co Ltd 感光性組成物
WO2013061428A1 (ja) * 2011-10-26 2013-05-02 フクビ化学工業株式会社 透明樹脂基板
US20140345923A1 (en) * 2011-12-09 2014-11-27 Dennis J. Miller Reducing dielectric loss in solder masks
JP2015152691A (ja) * 2014-02-12 2015-08-24 日油株式会社 インサート成形用防眩性反射防止フィルム及びこれを用いた樹脂成形品
US20190252212A1 (en) * 2017-01-03 2019-08-15 Stmicroelectronics (Grenoble 2) Sas Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3205817B2 (ja) * 1992-12-29 2001-09-04 タキロン株式会社 光散乱性合成樹脂成形品及びその製造方法
JP2007056158A (ja) * 2005-08-25 2007-03-08 Nagoya Institute Of Technology 樹脂組成物およびそれを用いた配線回路基板
JP5536977B2 (ja) * 2007-03-30 2014-07-02 パナソニック株式会社 面発光体
JP2017050399A (ja) 2015-09-02 2017-03-09 日立オートモティブシステムズ株式会社 車載制御装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0584775A (ja) * 1991-09-27 1993-04-06 Sekisui Chem Co Ltd 射出成形品の製造方法
JPH09185333A (ja) * 1996-01-04 1997-07-15 Toppan Printing Co Ltd 磁気可視記録媒体の製造方法及び磁気可視記録媒体
JP2001131552A (ja) * 1999-08-03 2001-05-15 Ishizuka Glass Co Ltd 難燃性付与用複合粒子
JP2003246009A (ja) * 2001-12-21 2003-09-02 Taisei Plas Co Ltd 金属と熱可塑性組成物の複合体とその製造方法
JP2011075786A (ja) * 2009-09-30 2011-04-14 Sekisui Chem Co Ltd 感光性組成物
WO2013061428A1 (ja) * 2011-10-26 2013-05-02 フクビ化学工業株式会社 透明樹脂基板
US20140345923A1 (en) * 2011-12-09 2014-11-27 Dennis J. Miller Reducing dielectric loss in solder masks
JP2015152691A (ja) * 2014-02-12 2015-08-24 日油株式会社 インサート成形用防眩性反射防止フィルム及びこれを用いた樹脂成形品
US20190252212A1 (en) * 2017-01-03 2019-08-15 Stmicroelectronics (Grenoble 2) Sas Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover

Also Published As

Publication number Publication date
JP7219372B2 (ja) 2023-02-07
US20240141183A1 (en) 2024-05-02
WO2022191063A1 (ja) 2022-09-15
EP4306603A1 (en) 2024-01-17

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