JPWO2022181764A1 - - Google Patents
Info
- Publication number
- JPWO2022181764A1 JPWO2022181764A1 JP2023502537A JP2023502537A JPWO2022181764A1 JP WO2022181764 A1 JPWO2022181764 A1 JP WO2022181764A1 JP 2023502537 A JP2023502537 A JP 2023502537A JP 2023502537 A JP2023502537 A JP 2023502537A JP WO2022181764 A1 JPWO2022181764 A1 JP WO2022181764A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/022—Mechanical properties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021029644 | 2021-02-26 | ||
PCT/JP2022/007881 WO2022181764A1 (en) | 2021-02-26 | 2022-02-25 | Multilayer structure and flexible printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022181764A1 true JPWO2022181764A1 (en) | 2022-09-01 |
Family
ID=83047534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023502537A Pending JPWO2022181764A1 (en) | 2021-02-26 | 2022-02-25 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2022181764A1 (en) |
KR (1) | KR20230151977A (en) |
CN (1) | CN116847983A (en) |
WO (1) | WO2022181764A1 (en) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004157419A (en) | 2002-11-08 | 2004-06-03 | Tamura Kaken Co Ltd | Photosensitive resin composition and manufacturing method of circuit board for electronic component |
JP2004361529A (en) * | 2003-06-03 | 2004-12-24 | Mitsui Chemicals Inc | Dry film for hard disk drive suspension board |
JP2013076833A (en) | 2011-09-30 | 2013-04-25 | Toyo Ink Sc Holdings Co Ltd | Photosensitive resin composition and cured product of the same, and production method of photosensitive resin |
JP6474989B2 (en) * | 2014-10-17 | 2019-02-27 | 太陽インキ製造株式会社 | Dry film and flexible printed wiring board |
WO2016163540A1 (en) * | 2015-04-08 | 2016-10-13 | 旭化成株式会社 | Photosensitive resin composition |
JP2018082184A (en) * | 2017-12-06 | 2018-05-24 | 味の素株式会社 | Resin sheet |
KR102223837B1 (en) * | 2018-06-21 | 2021-03-04 | 주식회사 엘지화학 | Branched copolymer, and photosensitive resin composition, photosensitive resin film, optical device using the same |
JP2019219631A (en) * | 2018-06-22 | 2019-12-26 | 日立化成株式会社 | Transfer film, cured film and method for forming the same, and electronic component |
-
2022
- 2022-02-25 CN CN202280012926.5A patent/CN116847983A/en active Pending
- 2022-02-25 KR KR1020237016578A patent/KR20230151977A/en unknown
- 2022-02-25 WO PCT/JP2022/007881 patent/WO2022181764A1/en active Application Filing
- 2022-02-25 JP JP2023502537A patent/JPWO2022181764A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2022181764A1 (en) | 2022-09-01 |
KR20230151977A (en) | 2023-11-02 |
CN116847983A (en) | 2023-10-03 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20230605 |