JPWO2022181281A1 - - Google Patents
Info
- Publication number
- JPWO2022181281A1 JPWO2022181281A1 JP2023502238A JP2023502238A JPWO2022181281A1 JP WO2022181281 A1 JPWO2022181281 A1 JP WO2022181281A1 JP 2023502238 A JP2023502238 A JP 2023502238A JP 2023502238 A JP2023502238 A JP 2023502238A JP WO2022181281 A1 JPWO2022181281 A1 JP WO2022181281A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021028204 | 2021-02-25 | ||
| PCT/JP2022/004234 WO2022181281A1 (ja) | 2021-02-25 | 2022-02-03 | 封止材組成物、半導体封止材料及び半導体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022181281A1 true JPWO2022181281A1 (ko) | 2022-09-01 |
Family
ID=83048217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023502238A Pending JPWO2022181281A1 (ko) | 2021-02-25 | 2022-02-03 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022181281A1 (ko) |
| TW (1) | TWI819493B (ko) |
| WO (1) | WO2022181281A1 (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023171353A1 (ja) * | 2022-03-08 | 2023-09-14 | 信越化学工業株式会社 | ２液型熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物 |
| WO2023171352A1 (ja) * | 2022-03-08 | 2023-09-14 | 信越化学工業株式会社 | 熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11246771A (ja) * | 1998-03-05 | 1999-09-14 | Ge Toshiba Silicone Kk | シリコーンゲル組成物 |
| JP4788837B2 (ja) * | 2010-01-26 | 2011-10-05 | 横浜ゴム株式会社 | シリコーン樹脂組成物およびその使用方法、シリコーン樹脂、シリコーン樹脂含有構造体、ならびに光半導体素子封止体 |
| JP5948240B2 (ja) * | 2010-04-22 | 2016-07-06 | 日本化薬株式会社 | 銀変色防止剤、銀変色防止樹脂組成物、銀変色防止方法、及びこれを使用した発光ダイオード |
| JP6205824B2 (ja) * | 2013-04-26 | 2017-10-04 | 富士電機株式会社 | パワーモジュール |
| EP3145961A4 (en) * | 2014-05-21 | 2018-06-27 | Dow Corning Corporation | Zinc containing catalysts, methods for preparing the catalysts, and compositions containing the catalysts |
| CN110177841A (zh) * | 2017-01-16 | 2019-08-27 | 株式会社大赛璐 | 固化性树脂组合物、其固化物及半导体装置 |
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2022
- 2022-02-03 WO PCT/JP2022/004234 patent/WO2022181281A1/ja active Application Filing
- 2022-02-03 JP JP2023502238A patent/JPWO2022181281A1/ja active Pending
- 2022-02-16 TW TW111105565A patent/TWI819493B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022181281A1 (ja) | 2022-09-01 |
| TWI819493B (zh) | 2023-10-21 |
| TW202300623A (zh) | 2023-01-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240625 |