JPWO2022181281A1 - - Google Patents

Info

Publication number
JPWO2022181281A1
JPWO2022181281A1 JP2023502238A JP2023502238A JPWO2022181281A1 JP WO2022181281 A1 JPWO2022181281 A1 JP WO2022181281A1 JP 2023502238 A JP2023502238 A JP 2023502238A JP 2023502238 A JP2023502238 A JP 2023502238A JP WO2022181281 A1 JPWO2022181281 A1 JP WO2022181281A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023502238A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022181281A1 publication Critical patent/JPWO2022181281A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098Metal salts of carboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/10Materials in mouldable or extrudable form for sealing or packing joints or covers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023502238A 2021-02-25 2022-02-03 Pending JPWO2022181281A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021028204 2021-02-25
PCT/JP2022/004234 WO2022181281A1 (ja) 2021-02-25 2022-02-03 封止材組成物、半導体封止材料及び半導体

Publications (1)

Publication Number Publication Date
JPWO2022181281A1 true JPWO2022181281A1 (ko) 2022-09-01

Family

ID=83048217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023502238A Pending JPWO2022181281A1 (ko) 2021-02-25 2022-02-03

Country Status (3)

Country Link
JP (1) JPWO2022181281A1 (ko)
TW (1) TWI819493B (ko)
WO (1) WO2022181281A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023171353A1 (ja) * 2022-03-08 2023-09-14 信越化学工業株式会社 2液型熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物
WO2023171352A1 (ja) * 2022-03-08 2023-09-14 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物及びそのシリコーン硬化物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11246771A (ja) * 1998-03-05 1999-09-14 Ge Toshiba Silicone Kk シリコーンゲル組成物
JP4788837B2 (ja) * 2010-01-26 2011-10-05 横浜ゴム株式会社 シリコーン樹脂組成物およびその使用方法、シリコーン樹脂、シリコーン樹脂含有構造体、ならびに光半導体素子封止体
JP5948240B2 (ja) * 2010-04-22 2016-07-06 日本化薬株式会社 銀変色防止剤、銀変色防止樹脂組成物、銀変色防止方法、及びこれを使用した発光ダイオード
JP6205824B2 (ja) * 2013-04-26 2017-10-04 富士電機株式会社 パワーモジュール
EP3145961A4 (en) * 2014-05-21 2018-06-27 Dow Corning Corporation Zinc containing catalysts, methods for preparing the catalysts, and compositions containing the catalysts
CN110177841A (zh) * 2017-01-16 2019-08-27 株式会社大赛璐 固化性树脂组合物、其固化物及半导体装置

Also Published As

Publication number Publication date
WO2022181281A1 (ja) 2022-09-01
TWI819493B (zh) 2023-10-21
TW202300623A (zh) 2023-01-01

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240625