JPWO2022172900A5 - - Google Patents
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- Publication number
- JPWO2022172900A5 JPWO2022172900A5 JP2022542775A JP2022542775A JPWO2022172900A5 JP WO2022172900 A5 JPWO2022172900 A5 JP WO2022172900A5 JP 2022542775 A JP2022542775 A JP 2022542775A JP 2022542775 A JP2022542775 A JP 2022542775A JP WO2022172900 A5 JPWO2022172900 A5 JP WO2022172900A5
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- hole
- ceramic plate
- contour line
- plate according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000919 ceramic Substances 0.000 claims 14
- 230000001678 irradiating effect Effects 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 238000005452 bending Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Claims (10)
前記貫通孔はレーザー光による切断で形成されたものであり、
前記主面における前記貫通孔の輪郭線は曲線状であり、
前記主面の中心と前記貫通孔の前記輪郭線との最長距離は、前記主面上に形成されるスクライブラインと前記貫通孔の前記輪郭線との最短距離よりも短い、セラミック板。 a main surface and a through hole formed through the main surface in the thickness direction and closer to the center than the outer edge of the main surface;
The through-hole is formed by cutting with a laser beam,
A contour line of the through hole on the main surface is curved ,
A ceramic plate , wherein the longest distance between the center of the main surface and the contour line of the through hole is shorter than the shortest distance between a scribe line formed on the main surface and the contour line of the through hole .
前記主面における前記貫通孔の輪郭線は曲線状であり、
前記主面の中心と前記貫通孔の前記輪郭線との最長距離は、前記主面上に形成されるスクライブラインと前記貫通孔の前記輪郭線との最短距離よりも短い、セラミック板の製造方法。 A step of irradiating a main surface of a plate-like ceramic base material with a laser beam and cutting out a part of the ceramic base material to form a through-hole penetrating in the thickness direction closer to the center than the outer edge of the main surface. has
A contour line of the through hole on the main surface is curved ,
A method for manufacturing a ceramic plate , wherein the longest distance between the center of the main surface and the contour line of the through hole is shorter than the shortest distance between a scribe line formed on the main surface and the contour line of the through hole. .
前記貫通孔が露出するように前記金属板の一部を除去して前記主面上に導体部を形成する工程と、を有する、回路基板の製造方法。 A step of laminating a metal plate so as to cover the main surface and the through hole of the ceramic plate according to any one of claims 1 to 5, and bonding the metal plate to the ceramic plate to produce a bonded substrate. When,
and forming a conductor portion on the main surface by removing a portion of the metal plate so as to expose the through hole.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021021101 | 2021-02-12 | ||
| PCT/JP2022/004738 WO2022172900A1 (en) | 2021-02-12 | 2022-02-07 | Ceramic plate and method for manufacturing same, and circuit board and method for manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022172900A1 JPWO2022172900A1 (en) | 2022-08-18 |
| JPWO2022172900A5 true JPWO2022172900A5 (en) | 2023-01-24 |
Family
ID=82837896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022542775A Pending JPWO2022172900A1 (en) | 2021-02-12 | 2022-02-07 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022172900A1 (en) |
| WO (1) | WO2022172900A1 (en) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0541169U (en) * | 1991-11-01 | 1993-06-01 | 三菱電機株式会社 | Printed board |
| US5614114A (en) * | 1994-07-18 | 1997-03-25 | Electro Scientific Industries, Inc. | Laser system and method for plating vias |
| JP2002223044A (en) * | 2001-01-24 | 2002-08-09 | Tdk Corp | Method for manufacturing electronic component and aggregate board |
| JP2005345526A (en) * | 2004-05-31 | 2005-12-15 | Sumitomo Heavy Ind Ltd | Method and apparatus of controlling galvanoscanner, and method of laser beam machining |
| JP2006134989A (en) * | 2004-11-04 | 2006-05-25 | Mitsubishi Electric Corp | Heat sink, heating element, heat-dissipating structure and heat exchanger |
| JP2011110589A (en) * | 2009-11-27 | 2011-06-09 | Hitachi Via Mechanics Ltd | Laser beam machining method |
| JP2011171349A (en) * | 2010-02-16 | 2011-09-01 | Kyocera Corp | Wiring board and electronic device using the same |
| JP6076217B2 (en) * | 2013-07-17 | 2017-02-08 | 三菱電機株式会社 | Substrate fixing structure and electronic device to which the substrate fixing structure is applied |
| JP2016051778A (en) * | 2014-08-29 | 2016-04-11 | Ｄｏｗａメタルテック株式会社 | Metal-ceramic bonded substrate |
| JPWO2019167942A1 (en) * | 2018-02-27 | 2020-04-16 | 三菱マテリアル株式会社 | Isolated circuit board |
-
2022
- 2022-02-07 JP JP2022542775A patent/JPWO2022172900A1/ja active Pending
- 2022-02-07 WO PCT/JP2022/004738 patent/WO2022172900A1/en active Application Filing
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