JPWO2022168707A1 - - Google Patents
Info
- Publication number
- JPWO2022168707A1 JPWO2022168707A1 JP2022508783A JP2022508783A JPWO2022168707A1 JP WO2022168707 A1 JPWO2022168707 A1 JP WO2022168707A1 JP 2022508783 A JP2022508783 A JP 2022508783A JP 2022508783 A JP2022508783 A JP 2022508783A JP WO2022168707 A1 JPWO2022168707 A1 JP WO2022168707A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/223—Di-epoxy compounds together with monoepoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/308—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing halogen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2150/00—Compositions for coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021016548 | 2021-02-04 | ||
| PCT/JP2022/002871 WO2022168707A1 (en) | 2021-02-04 | 2022-01-26 | Photocurable resin composition for electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022168707A1 true JPWO2022168707A1 (en) | 2022-08-11 |
Family
ID=82741631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022508783A Pending JPWO2022168707A1 (en) | 2021-02-04 | 2022-01-26 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2022168707A1 (en) |
| KR (1) | KR20230135563A (en) |
| CN (1) | CN116670197A (en) |
| WO (1) | WO2022168707A1 (en) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4853225B2 (en) * | 2006-10-20 | 2012-01-11 | 住友ベークライト株式会社 | Resin composition and semiconductor device produced using resin composition |
| JP5280043B2 (en) * | 2007-12-12 | 2013-09-04 | 株式会社Ｄｎｐファインケミカル | Liquid crystal alignment control protrusion and color filter |
| CN102083918A (en) * | 2008-05-23 | 2011-06-01 | 乐泰研究与发展有限公司 | Surface-promoted cure of one-part cationically curable compositions |
| JP5794380B2 (en) * | 2012-02-29 | 2015-10-14 | 株式会社村田製作所 | Dielectric resin composition for film capacitor |
| JP6057600B2 (en) | 2012-08-09 | 2017-01-11 | 日東電工株式会社 | Adhesive, adhesive layer, and adhesive sheet |
| JP2018048274A (en) * | 2016-09-23 | 2018-03-29 | 東ソー株式会社 | Active energy ray-curable composite resin composition, active energy ray-curable composite resin adhesive using the composition, and adhesive tape for bonding optical member |
| JP6410158B2 (en) * | 2016-10-07 | 2018-10-24 | パナソニックＩｐマネジメント株式会社 | Ultraviolet curable resin composition, organic EL light emitting device manufacturing method, and organic EL light emitting device |
| JP7199004B2 (en) * | 2017-04-28 | 2023-01-05 | パナソニックＩｐマネジメント株式会社 | UV curable resin composition and organic EL light emitting device |
| JP2020200462A (en) * | 2019-06-10 | 2020-12-17 | パナソニックＩｐマネジメント株式会社 | Ultraviolet curable resin composition, method for producing light emitting device and light emitting device |
-
2022
- 2022-01-26 JP JP2022508783A patent/JPWO2022168707A1/ja active Pending
- 2022-01-26 CN CN202280008692.7A patent/CN116670197A/en active Pending
- 2022-01-26 KR KR1020237018483A patent/KR20230135563A/en unknown
- 2022-01-26 WO PCT/JP2022/002871 patent/WO2022168707A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN116670197A (en) | 2023-08-29 |
| WO2022168707A1 (en) | 2022-08-11 |
| KR20230135563A (en) | 2023-09-25 |