JPWO2022168694A1 - - Google Patents
Info
- Publication number
- JPWO2022168694A1 JPWO2022168694A1 JP2022530810A JP2022530810A JPWO2022168694A1 JP WO2022168694 A1 JPWO2022168694 A1 JP WO2022168694A1 JP 2022530810 A JP2022530810 A JP 2022530810A JP 2022530810 A JP2022530810 A JP 2022530810A JP WO2022168694 A1 JPWO2022168694 A1 JP WO2022168694A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021015658 | 2021-02-03 | ||
| JP2021015658 | 2021-02-03 | ||
| PCT/JP2022/002834 WO2022168694A1 (en) | 2021-02-03 | 2022-01-26 | Encapsulating resin composition and semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022168694A1 true JPWO2022168694A1 (en) | 2022-08-11 |
| JP7151940B1 JP7151940B1 (en) | 2022-10-12 |
Family
ID=82741617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022530810A Active JP7151940B1 (en) | 2021-02-03 | 2022-01-26 | Encapsulating resin composition and semiconductor device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7151940B1 (en) |
| CN (1) | CN116745903B (en) |
| WO (1) | WO2022168694A1 (en) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5359263B2 (en) * | 2008-12-26 | 2013-12-04 | 東洋紡株式会社 | Resin composition for sealing electric and electronic parts, method for producing sealed electric and electronic parts, and sealed electric and electronic parts |
| JP6388228B2 (en) * | 2013-12-27 | 2018-09-12 | パナソニックＩｐマネジメント株式会社 | Liquid epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| JP2017101140A (en) * | 2015-12-01 | 2017-06-08 | 三菱化学株式会社 | Resin composition and semiconductor device having layer consisting of the resin composition |
| JP7091618B2 (en) * | 2016-09-27 | 2022-06-28 | 住友ベークライト株式会社 | Capacitance type sensor encapsulation resin composition and capacitance type sensor |
| KR102411863B1 (en) * | 2017-03-01 | 2022-06-22 | 도요보 가부시키가이샤 | A laminate and packaging bag comprising a polyester film having a furandicarboxylic acid unit and a heat-sealable resin layer |
| KR102387943B1 (en) * | 2017-05-17 | 2022-04-18 | 린텍 가부시키가이샤 | Semiconductor device and method for manufacturing same |
| JP7127251B2 (en) * | 2017-06-05 | 2022-08-30 | 住友ベークライト株式会社 | Sealing resin composition and structure |
| JP7007827B2 (en) * | 2017-07-28 | 2022-01-25 | 日東電工株式会社 | Die bond film, dicing die bond film, and semiconductor device manufacturing method |
| CN111279463B (en) * | 2017-10-27 | 2023-09-26 | 琳得科株式会社 | Film for forming protective film, composite sheet for forming protective film, and method for manufacturing semiconductor chip |
| JP7225553B2 (en) * | 2018-03-30 | 2023-02-21 | 住友ベークライト株式会社 | Resin sheet for forming solder resist |
| JP2020152825A (en) * | 2019-03-20 | 2020-09-24 | 日立化成株式会社 | Resin composition for sealing, electronic component device, and production method for electronic component device |
| JP2020193293A (en) * | 2019-05-29 | 2020-12-03 | 昭和電工マテリアルズ株式会社 | Sealing resin composition, cured product, and electronic component device |
| JP7333211B2 (en) * | 2019-06-21 | 2023-08-24 | リンテック株式会社 | Composite sheet for forming protective film and method for manufacturing semiconductor chip with protective film |
-
2022
- 2022-01-26 JP JP2022530810A patent/JP7151940B1/en active Active
- 2022-01-26 CN CN202280009598.3A patent/CN116745903B/en active Active
- 2022-01-26 WO PCT/JP2022/002834 patent/WO2022168694A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022168694A1 (en) | 2022-08-11 |
| JP7151940B1 (en) | 2022-10-12 |
| CN116745903A (en) | 2023-09-12 |
| CN116745903B (en) | 2024-02-02 |
Similar Documents
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