JPWO2022158485A1 - - Google Patents
Info
- Publication number
- JPWO2022158485A1 JPWO2022158485A1 JP2022576717A JP2022576717A JPWO2022158485A1 JP WO2022158485 A1 JPWO2022158485 A1 JP WO2022158485A1 JP 2022576717 A JP2022576717 A JP 2022576717A JP 2022576717 A JP2022576717 A JP 2022576717A JP WO2022158485 A1 JPWO2022158485 A1 JP WO2022158485A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D5/00—Planing or slotting machines cutting otherwise than by relative movement of the tool and workpiece in a straight line
- B23D5/02—Planing or slotting machines cutting otherwise than by relative movement of the tool and workpiece in a straight line involving rotary and straight-line movements only, e.g. for cutting helical grooves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021008306 | 2021-01-21 | ||
PCT/JP2022/001764 WO2022158485A1 (ja) | 2021-01-21 | 2022-01-19 | ウエハの裏面研削方法及び電子デバイスの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022158485A1 true JPWO2022158485A1 (ja) | 2022-07-28 |
Family
ID=82549415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022576717A Pending JPWO2022158485A1 (ja) | 2021-01-21 | 2022-01-19 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2022158485A1 (ja) |
TW (1) | TW202236407A (ja) |
WO (1) | WO2022158485A1 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5877663B2 (ja) * | 2011-07-07 | 2016-03-08 | 株式会社ディスコ | ウエーハの研削方法 |
JP5890977B2 (ja) * | 2011-07-20 | 2016-03-22 | 株式会社ディスコ | 加工方法 |
JP5959188B2 (ja) * | 2011-12-05 | 2016-08-02 | 株式会社ディスコ | ウエーハの加工方法 |
JP6963409B2 (ja) * | 2017-05-09 | 2021-11-10 | 株式会社ディスコ | ウェーハの加工方法 |
-
2022
- 2022-01-19 JP JP2022576717A patent/JPWO2022158485A1/ja active Pending
- 2022-01-19 WO PCT/JP2022/001764 patent/WO2022158485A1/ja active Application Filing
- 2022-01-21 TW TW111102625A patent/TW202236407A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2022158485A1 (ja) | 2022-07-28 |
TW202236407A (zh) | 2022-09-16 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230623 |