JPWO2022158461A1 - - Google Patents
Info
- Publication number
- JPWO2022158461A1 JPWO2022158461A1 JP2022576698A JP2022576698A JPWO2022158461A1 JP WO2022158461 A1 JPWO2022158461 A1 JP WO2022158461A1 JP 2022576698 A JP2022576698 A JP 2022576698A JP 2022576698 A JP2022576698 A JP 2022576698A JP WO2022158461 A1 JPWO2022158461 A1 JP WO2022158461A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021006770 | 2021-01-19 | ||
JP2021006770 | 2021-01-19 | ||
PCT/JP2022/001680 WO2022158461A1 (ja) | 2021-01-19 | 2022-01-18 | 半導体転写用フラックスシート |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022158461A1 true JPWO2022158461A1 (ja) | 2022-07-28 |
JP7313584B2 JP7313584B2 (ja) | 2023-07-24 |
Family
ID=82549459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022576698A Active JP7313584B2 (ja) | 2021-01-19 | 2022-01-18 | 半導体転写用フラックスシート |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP4282575A1 (ja) |
JP (1) | JP7313584B2 (ja) |
KR (1) | KR20230131932A (ja) |
CN (1) | CN116829298A (ja) |
TW (1) | TW202248395A (ja) |
WO (1) | WO2022158461A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023238676A1 (ja) * | 2022-06-10 | 2023-12-14 | ナガセケムテックス株式会社 | 部品捕捉用水溶性粘着組成物及び部品捕捉用水溶性粘着シート並びに電子部品の製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013110403A (ja) * | 2011-10-26 | 2013-06-06 | Hitachi Chemical Co Ltd | リフローフィルム、はんだバンプ形成方法、はんだ接合の形成方法及び半導体装置 |
JP2013110405A (ja) * | 2011-10-26 | 2013-06-06 | Hitachi Chemical Co Ltd | リフローフィルム、はんだバンプ形成方法、はんだ接合の形成方法及び半導体装置 |
JP2013110402A (ja) * | 2011-10-26 | 2013-06-06 | Hitachi Chemical Co Ltd | リフローフィルム、はんだバンプ形成方法、はんだ接合の形成方法及び半導体装置 |
JP2014168791A (ja) * | 2013-03-01 | 2014-09-18 | Hitachi Chemical Co Ltd | フラックスフィルム、フリップチップ接続方法、及び半導体装置 |
WO2016043092A1 (ja) * | 2014-09-19 | 2016-03-24 | ソニー株式会社 | 実装基板およびその製造方法 |
WO2020116403A1 (ja) * | 2018-12-03 | 2020-06-11 | ナガセケムテックス株式会社 | フラックスシート及びフラックスシートを用いたはんだ接合方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3906653B2 (ja) | 2000-07-18 | 2007-04-18 | ソニー株式会社 | 画像表示装置及びその製造方法 |
JP2010161221A (ja) | 2009-01-08 | 2010-07-22 | Sony Corp | 実装基板の製造方法、実装基板および発光装置 |
JP2021006770A (ja) | 2019-06-28 | 2021-01-21 | 株式会社ゼンリンデータコム | 経路表示装置、経路表示方法、および、コンピュータプログラム |
CN111055045A (zh) * | 2019-12-29 | 2020-04-24 | 武汉风帆电化科技股份有限公司 | 一种光伏焊带专用助焊剂 |
-
2022
- 2022-01-18 KR KR1020237028192A patent/KR20230131932A/ko unknown
- 2022-01-18 WO PCT/JP2022/001680 patent/WO2022158461A1/ja active Application Filing
- 2022-01-18 CN CN202280010601.3A patent/CN116829298A/zh active Pending
- 2022-01-18 JP JP2022576698A patent/JP7313584B2/ja active Active
- 2022-01-18 EP EP22742583.2A patent/EP4282575A1/en active Pending
- 2022-01-19 TW TW111102158A patent/TW202248395A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013110403A (ja) * | 2011-10-26 | 2013-06-06 | Hitachi Chemical Co Ltd | リフローフィルム、はんだバンプ形成方法、はんだ接合の形成方法及び半導体装置 |
JP2013110405A (ja) * | 2011-10-26 | 2013-06-06 | Hitachi Chemical Co Ltd | リフローフィルム、はんだバンプ形成方法、はんだ接合の形成方法及び半導体装置 |
JP2013110402A (ja) * | 2011-10-26 | 2013-06-06 | Hitachi Chemical Co Ltd | リフローフィルム、はんだバンプ形成方法、はんだ接合の形成方法及び半導体装置 |
JP2014168791A (ja) * | 2013-03-01 | 2014-09-18 | Hitachi Chemical Co Ltd | フラックスフィルム、フリップチップ接続方法、及び半導体装置 |
WO2016043092A1 (ja) * | 2014-09-19 | 2016-03-24 | ソニー株式会社 | 実装基板およびその製造方法 |
WO2020116403A1 (ja) * | 2018-12-03 | 2020-06-11 | ナガセケムテックス株式会社 | フラックスシート及びフラックスシートを用いたはんだ接合方法 |
Also Published As
Publication number | Publication date |
---|---|
CN116829298A (zh) | 2023-09-29 |
WO2022158461A1 (ja) | 2022-07-28 |
EP4282575A1 (en) | 2023-11-29 |
JP7313584B2 (ja) | 2023-07-24 |
TW202248395A (zh) | 2022-12-16 |
KR20230131932A (ko) | 2023-09-14 |
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