JPWO2022154102A1 - - Google Patents

Info

Publication number
JPWO2022154102A1
JPWO2022154102A1 JP2022575656A JP2022575656A JPWO2022154102A1 JP WO2022154102 A1 JPWO2022154102 A1 JP WO2022154102A1 JP 2022575656 A JP2022575656 A JP 2022575656A JP 2022575656 A JP2022575656 A JP 2022575656A JP WO2022154102 A1 JPWO2022154102 A1 JP WO2022154102A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022575656A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022154102A1 publication Critical patent/JPWO2022154102A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP2022575656A 2021-01-15 2022-01-14 Pending JPWO2022154102A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021005362 2021-01-15
PCT/JP2021/026045 WO2022153580A1 (ja) 2021-01-15 2021-07-09 表面処理銅箔、銅張積層板及びプリント配線板
PCT/JP2022/001216 WO2022154102A1 (ja) 2021-01-15 2022-01-14 表面処理銅箔、銅張積層板及びプリント配線板

Publications (1)

Publication Number Publication Date
JPWO2022154102A1 true JPWO2022154102A1 (ja) 2022-07-21

Family

ID=82447065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022575656A Pending JPWO2022154102A1 (ja) 2021-01-15 2022-01-14

Country Status (4)

Country Link
JP (1) JPWO2022154102A1 (ja)
KR (1) KR20230104700A (ja)
TW (1) TW202229651A (ja)
WO (2) WO2022153580A1 (ja)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2717911B2 (ja) * 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JP5406278B2 (ja) * 2009-03-27 2014-02-05 Ｊｘ日鉱日石金属株式会社 プリント配線板用銅箔及びその製造方法
JP2012112009A (ja) 2010-11-26 2012-06-14 Hitachi Cable Ltd 銅箔、及び銅箔の製造方法
JP6077458B2 (ja) * 2010-12-14 2017-02-08 スリーエム イノベイティブ プロパティズ カンパニー 物品を作製する方法
KR102059280B1 (ko) * 2011-09-30 2019-12-24 제이엑스금속주식회사 수지와의 밀착성이 우수한 동박 및 그 제조 방법 그리고 그 전해 동박을 사용한 프린트 배선판 또는 전지용 부극재
JP5481577B1 (ja) * 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔
JP5710845B2 (ja) * 2012-11-26 2015-04-30 Jx日鉱日石金属株式会社 表面処理電解銅箔、積層板、プリント配線板、及び電子機器
JP6462961B2 (ja) * 2016-12-14 2019-01-30 古河電気工業株式会社 表面処理銅箔および銅張積層板
TW201900939A (zh) * 2017-05-09 2019-01-01 日商Ｊｘ金屬股份有限公司 電解銅箔、覆銅積層板、印刷配線板及其製造方法、以及電子機器及其製造方法
TWI697574B (zh) * 2019-11-27 2020-07-01 長春石油化學股份有限公司 電解銅箔、電極及包含其之鋰離子電池
JP7259093B2 (ja) * 2020-02-04 2023-04-17 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Also Published As

Publication number Publication date
KR20230104700A (ko) 2023-07-10
TW202229651A (zh) 2022-08-01
WO2022153580A1 (ja) 2022-07-21
WO2022154102A1 (ja) 2022-07-21

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