JPWO2022154016A1 - - Google Patents
Info
- Publication number
- JPWO2022154016A1 JPWO2022154016A1 JP2022575610A JP2022575610A JPWO2022154016A1 JP WO2022154016 A1 JPWO2022154016 A1 JP WO2022154016A1 JP 2022575610 A JP2022575610 A JP 2022575610A JP 2022575610 A JP2022575610 A JP 2022575610A JP WO2022154016 A1 JPWO2022154016 A1 JP WO2022154016A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021005836 | 2021-01-18 | ||
| PCT/JP2022/000756 WO2022154016A1 (ja) | 2021-01-18 | 2022-01-12 | 研磨用組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022154016A1 true JPWO2022154016A1 (ja) | 2022-07-21 |
Family
ID=82446711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022575610A Pending JPWO2022154016A1 (ja) | 2021-01-18 | 2022-01-12 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4279562A1 (ja) |
| JP (1) | JPWO2022154016A1 (ja) |
| KR (1) | KR20230134132A (ja) |
| CN (1) | CN116848211A (ja) |
| TW (1) | TW202246431A (ja) |
| WO (1) | WO2022154016A1 (ja) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5204960B2 (ja) * | 2006-08-24 | 2013-06-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
| JP5967370B2 (ja) * | 2010-05-11 | 2016-08-10 | 日産化学工業株式会社 | シリコンウェーハ用研磨組成物及びシリコンウェーハの研磨方法 |
| JP7026043B2 (ja) * | 2016-08-02 | 2022-02-25 | 株式会社フジミインコーポレーテッド | シリコンウェーハ粗研磨用組成物の製造方法、シリコンウェーハ粗研磨用組成物セット、およびシリコンウェーハの研磨方法 |
| WO2018043504A1 (ja) * | 2016-08-31 | 2018-03-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨用組成物セット |
| JP7237933B2 (ja) | 2018-03-28 | 2023-03-13 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP7253335B2 (ja) | 2018-07-31 | 2023-04-06 | 株式会社フジミインコーポレーテッド | 研磨用組成物、その製造方法および研磨用組成物を用いた研磨方法 |
| WO2020100563A1 (ja) * | 2018-11-12 | 2020-05-22 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| CN111378381A (zh) * | 2018-12-29 | 2020-07-07 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| JP2021005836A (ja) | 2019-06-27 | 2021-01-14 | 日本電波工業株式会社 | セラミックパッケージ及び圧電デバイス |
-
2022
- 2022-01-12 CN CN202280010432.3A patent/CN116848211A/zh active Pending
- 2022-01-12 EP EP22739421.0A patent/EP4279562A1/en active Pending
- 2022-01-12 KR KR1020237027527A patent/KR20230134132A/ko unknown
- 2022-01-12 WO PCT/JP2022/000756 patent/WO2022154016A1/ja active Application Filing
- 2022-01-12 JP JP2022575610A patent/JPWO2022154016A1/ja active Pending
- 2022-01-17 TW TW111101792A patent/TW202246431A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230134132A (ko) | 2023-09-20 |
| WO2022154016A1 (ja) | 2022-07-21 |
| CN116848211A (zh) | 2023-10-03 |
| EP4279562A1 (en) | 2023-11-22 |
| TW202246431A (zh) | 2022-12-01 |