JPWO2022145206A1 - - Google Patents

Info

Publication number
JPWO2022145206A1
JPWO2022145206A1 JP2022572974A JP2022572974A JPWO2022145206A1 JP WO2022145206 A1 JPWO2022145206 A1 JP WO2022145206A1 JP 2022572974 A JP2022572974 A JP 2022572974A JP 2022572974 A JP2022572974 A JP 2022572974A JP WO2022145206 A1 JPWO2022145206 A1 JP WO2022145206A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022572974A
Other versions
JP7518209B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022145206A1 publication Critical patent/JPWO2022145206A1/ja
Application granted granted Critical
Publication of JP7518209B2 publication Critical patent/JP7518209B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Support Of Aerials (AREA)
JP2022572974A 2020-12-28 2021-12-10 アンテナ装置 Active JP7518209B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020219293 2020-12-28
JP2020219293 2020-12-28
PCT/JP2021/045615 WO2022145206A1 (ja) 2020-12-28 2021-12-10 アンテナ装置

Publications (2)

Publication Number Publication Date
JPWO2022145206A1 true JPWO2022145206A1 (ja) 2022-07-07
JP7518209B2 JP7518209B2 (ja) 2024-07-17

Family

ID=82260444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022572974A Active JP7518209B2 (ja) 2020-12-28 2021-12-10 アンテナ装置

Country Status (5)

Country Link
US (1) US20240047894A1 (ja)
EP (1) EP4270661A1 (ja)
JP (1) JP7518209B2 (ja)
CN (1) CN116670822A (ja)
WO (1) WO2022145206A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2580604B2 (ja) * 1987-06-19 1997-02-12 三菱電機株式会社 アンテナ一体化マイクロ波集積回路
JPH0774538A (ja) * 1992-11-04 1995-03-17 Furukawa Electric Co Ltd:The 平面アンテナ付電子回路ユニット
WO2010102454A1 (zh) 2009-03-13 2010-09-16 华为技术有限公司 一种射频单元以及集成天线
JP2011211424A (ja) 2010-03-29 2011-10-20 Panasonic Corp ミリ波送受信機
US11205623B2 (en) 2017-03-13 2021-12-21 Mitsubishi Electric Corporation Microwave device and antenna for improving heat dissipation
WO2018182756A1 (en) 2017-04-01 2018-10-04 Intel Corporation 5G mmWAVE COOLING THROUGH PCB

Also Published As

Publication number Publication date
EP4270661A1 (en) 2023-11-01
US20240047894A1 (en) 2024-02-08
WO2022145206A1 (ja) 2022-07-07
CN116670822A (zh) 2023-08-29
JP7518209B2 (ja) 2024-07-17

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