JPWO2022145059A1 - - Google Patents
Info
- Publication number
- JPWO2022145059A1 JPWO2022145059A1 JP2022572886A JP2022572886A JPWO2022145059A1 JP WO2022145059 A1 JPWO2022145059 A1 JP WO2022145059A1 JP 2022572886 A JP2022572886 A JP 2022572886A JP 2022572886 A JP2022572886 A JP 2022572886A JP WO2022145059 A1 JPWO2022145059 A1 JP WO2022145059A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
- H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/174—Membranes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/176—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of ceramic material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202063131078P | 2020-12-28 | 2020-12-28 | |
PCT/JP2021/012854 WO2022145059A1 (ja) | 2020-12-28 | 2021-03-26 | 膜構造体及び電子デバイス |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022145059A1 true JPWO2022145059A1 (ja) | 2022-07-07 |
Family
ID=82259208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022572886A Pending JPWO2022145059A1 (ja) | 2020-12-28 | 2021-03-26 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20240048121A1 (ja) |
EP (1) | EP4270505A1 (ja) |
JP (1) | JPWO2022145059A1 (ja) |
CN (1) | CN117461405A (ja) |
TW (1) | TW202240943A (ja) |
WO (1) | WO2022145059A1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3529993B2 (ja) * | 1996-11-07 | 2004-05-24 | 日本碍子株式会社 | 圧電素子 |
JP3953315B2 (ja) | 2001-12-26 | 2007-08-08 | 宇部興産株式会社 | 窒化アルミニウム薄膜−金属電極積層体およびそれを用いた薄膜圧電共振子 |
JP5770344B2 (ja) * | 2008-01-30 | 2015-08-26 | 日本碍子株式会社 | 圧電/電歪膜型素子の製造方法 |
EP2377176B1 (en) * | 2008-12-17 | 2016-12-14 | Analog Devices, Inc. | Mechanical resonating structures including a temperature compensation structure |
JP5760172B2 (ja) * | 2011-02-01 | 2015-08-05 | パナソニックIpマネジメント株式会社 | 発電デバイスおよびそれを用いた発電モジュール |
JP7447372B2 (ja) * | 2018-05-17 | 2024-03-12 | サムソン エレクトロ-メカニックス カンパニーリミテッド. | バルク音響共振器及びその製造方法 |
-
2021
- 2021-03-26 EP EP21914921.8A patent/EP4270505A1/en active Pending
- 2021-03-26 CN CN202180087656.XA patent/CN117461405A/zh active Pending
- 2021-03-26 JP JP2022572886A patent/JPWO2022145059A1/ja active Pending
- 2021-03-26 WO PCT/JP2021/012854 patent/WO2022145059A1/ja active Application Filing
- 2021-03-26 US US18/265,067 patent/US20240048121A1/en active Pending
- 2021-12-27 TW TW110148914A patent/TW202240943A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2022145059A1 (ja) | 2022-07-07 |
CN117461405A (zh) | 2024-01-26 |
US20240048121A1 (en) | 2024-02-08 |
TW202240943A (zh) | 2022-10-16 |
EP4270505A1 (en) | 2023-11-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20240112 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240306 |