JPWO2022138946A1 - - Google Patents

Info

Publication number
JPWO2022138946A1
JPWO2022138946A1 JP2022571701A JP2022571701A JPWO2022138946A1 JP WO2022138946 A1 JPWO2022138946 A1 JP WO2022138946A1 JP 2022571701 A JP2022571701 A JP 2022571701A JP 2022571701 A JP2022571701 A JP 2022571701A JP WO2022138946 A1 JPWO2022138946 A1 JP WO2022138946A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022571701A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022138946A1 publication Critical patent/JPWO2022138946A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP2022571701A 2020-12-25 2021-12-24 Pending JPWO2022138946A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020218037 2020-12-25
PCT/JP2021/048342 WO2022138946A1 (ja) 2020-12-25 2021-12-24 半導体チップの製造方法

Publications (1)

Publication Number Publication Date
JPWO2022138946A1 true JPWO2022138946A1 (ja) 2022-06-30

Family

ID=82158251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022571701A Pending JPWO2022138946A1 (ja) 2020-12-25 2021-12-24

Country Status (4)

Country Link
JP (1) JPWO2022138946A1 (ja)
CN (1) CN116686067A (ja)
TW (1) TW202232588A (ja)
WO (1) WO2022138946A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9508623B2 (en) * 2014-06-08 2016-11-29 UTAC Headquarters Pte. Ltd. Semiconductor packages and methods of packaging semiconductor devices
KR102538766B1 (ko) * 2015-11-04 2023-05-31 린텍 가부시키가이샤 경화성 수지 필름 및 제1 보호막 형성용 시트
JP6730910B2 (ja) * 2016-10-18 2020-07-29 株式会社ディスコ ウエーハの樹脂被覆方法
TWI783082B (zh) * 2017-11-17 2022-11-11 日商琳得科股份有限公司 熱硬化性樹脂膜及第一保護膜形成用片材
WO2020085220A1 (ja) * 2018-10-22 2020-04-30 リンテック株式会社 半導体装置の製造方法
WO2021171898A1 (ja) * 2020-02-27 2021-09-02 リンテック株式会社 保護膜形成用シート、保護膜付きチップの製造方法、及び積層物

Also Published As

Publication number Publication date
WO2022138946A1 (ja) 2022-06-30
TW202232588A (zh) 2022-08-16
CN116686067A (zh) 2023-09-01

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