JPWO2022138087A1 - - Google Patents
Info
- Publication number
- JPWO2022138087A1 JPWO2022138087A1 JP2022572068A JP2022572068A JPWO2022138087A1 JP WO2022138087 A1 JPWO2022138087 A1 JP WO2022138087A1 JP 2022572068 A JP2022572068 A JP 2022572068A JP 2022572068 A JP2022572068 A JP 2022572068A JP WO2022138087 A1 JPWO2022138087 A1 JP WO2022138087A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/60—Amplifiers in which coupling networks have distributed constants, e.g. with waveguide resonators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguide Connection Structure (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020213011 | 2020-12-22 | ||
| JP2020213011 | 2020-12-22 | ||
| PCT/JP2021/044579 WO2022138087A1 (ja) | 2020-12-22 | 2021-12-03 | 広帯域伝送線路配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022138087A1 true JPWO2022138087A1 (ja) | 2022-06-30 |
| JP7524977B2 JP7524977B2 (ja) | 2024-07-30 |
Family
ID=82159462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022572068A Active JP7524977B2 (ja) | 2020-12-22 | 2021-12-03 | 広帯域伝送線路配線基板 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7524977B2 (ja) |
| WO (1) | WO2022138087A1 (ja) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4620643B2 (ja) * | 2006-08-16 | 2011-01-26 | 富士通オプティカルコンポーネンツ株式会社 | インダクタ配線基板、インダクタ配線方法及びバイアスｔ回路 |
| JP6536525B2 (ja) * | 2016-10-04 | 2019-07-03 | 株式会社村田製作所 | バイアスｔ回路 |
-
2021
- 2021-12-03 WO PCT/JP2021/044579 patent/WO2022138087A1/ja active Application Filing
- 2021-12-03 JP JP2022572068A patent/JP7524977B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022138087A1 (ja) | 2022-06-30 |
| JP7524977B2 (ja) | 2024-07-30 |
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