JPWO2022118723A1 - - Google Patents
Info
- Publication number
- JPWO2022118723A1 JPWO2022118723A1 JP2022566870A JP2022566870A JPWO2022118723A1 JP WO2022118723 A1 JPWO2022118723 A1 JP WO2022118723A1 JP 2022566870 A JP2022566870 A JP 2022566870A JP 2022566870 A JP2022566870 A JP 2022566870A JP WO2022118723 A1 JPWO2022118723 A1 JP WO2022118723A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020200933 | 2020-12-03 | ||
| JP2020200933 | 2020-12-03 | ||
| PCT/JP2021/043092 WO2022118723A1 (en) | 2020-12-03 | 2021-11-25 | Epoxy resin, curable composition, cured product, semiconductor sealing material, semiconductor device, prepreg, circuit board and buildup film |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022118723A1 true JPWO2022118723A1 (en) | 2022-06-09 |
| JPWO2022118723A5 JPWO2022118723A5 (en) | 2023-04-20 |
| JP7290205B2 JP7290205B2 (en) | 2023-06-13 |
Family
ID=81855009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022566870A Active JP7290205B2 (en) | 2020-12-03 | 2021-11-25 | Epoxy resins, curable compositions, cured products, semiconductor sealing materials, semiconductor devices, prepregs, circuit boards, and build-up films |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7290205B2 (en) |
| KR (1) | KR20230059829A (en) |
| CN (1) | CN116583943A (en) |
| TW (1) | TW202231701A (en) |
| WO (1) | WO2022118723A1 (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0212225B2 (en) * | 1981-09-02 | 1990-03-19 | Mitsubishi Petrochemical Co | |
| JPH1160681A (en) * | 1997-08-14 | 1999-03-02 | Jsr Corp | Biphenol epoxy resin and its composition |
| JP2000044775A (en) * | 1998-07-28 | 2000-02-15 | Yuka Shell Epoxy Kk | Epoxy resin composition for semiconductor sealing |
| JP2007039551A (en) * | 2005-08-03 | 2007-02-15 | Dainippon Ink & Chem Inc | Epoxy resin, epoxy resin composition, cured product, semiconductor device, and method for producing the epoxy resin |
| JP2011026385A (en) * | 2009-07-22 | 2011-02-10 | Dic Corp | Epoxy resin composition, cured product thereof, semiconductor sealing material, semiconductor device and epoxy resin |
| JP2014037487A (en) * | 2012-08-16 | 2014-02-27 | Dic Corp | Curable resin composition, cured product, and printed wiring board |
| WO2015037584A1 (en) * | 2013-09-10 | 2015-03-19 | 日本化薬株式会社 | Epoxy resin mixture, epoxy resin composition, cured product and semiconductor device |
| JP2018138681A (en) * | 2016-04-04 | 2018-09-06 | Dic株式会社 | Method for producing epoxy resin composition |
-
2021
- 2021-11-25 WO PCT/JP2021/043092 patent/WO2022118723A1/en active Application Filing
- 2021-11-25 KR KR1020237011018A patent/KR20230059829A/en unknown
- 2021-11-25 CN CN202180081331.0A patent/CN116583943A/en active Pending
- 2021-11-25 JP JP2022566870A patent/JP7290205B2/en active Active
- 2021-11-25 TW TW110143922A patent/TW202231701A/en unknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0212225B2 (en) * | 1981-09-02 | 1990-03-19 | Mitsubishi Petrochemical Co | |
| JPH1160681A (en) * | 1997-08-14 | 1999-03-02 | Jsr Corp | Biphenol epoxy resin and its composition |
| JP2000044775A (en) * | 1998-07-28 | 2000-02-15 | Yuka Shell Epoxy Kk | Epoxy resin composition for semiconductor sealing |
| JP2007039551A (en) * | 2005-08-03 | 2007-02-15 | Dainippon Ink & Chem Inc | Epoxy resin, epoxy resin composition, cured product, semiconductor device, and method for producing the epoxy resin |
| JP2011026385A (en) * | 2009-07-22 | 2011-02-10 | Dic Corp | Epoxy resin composition, cured product thereof, semiconductor sealing material, semiconductor device and epoxy resin |
| JP2014037487A (en) * | 2012-08-16 | 2014-02-27 | Dic Corp | Curable resin composition, cured product, and printed wiring board |
| WO2015037584A1 (en) * | 2013-09-10 | 2015-03-19 | 日本化薬株式会社 | Epoxy resin mixture, epoxy resin composition, cured product and semiconductor device |
| JP2018138681A (en) * | 2016-04-04 | 2018-09-06 | Dic株式会社 | Method for producing epoxy resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022118723A1 (en) | 2022-06-09 |
| CN116583943A (en) | 2023-08-11 |
| KR20230059829A (en) | 2023-05-03 |
| JP7290205B2 (en) | 2023-06-13 |
| TW202231701A (en) | 2022-08-16 |
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