JPWO2022114210A5 - - Google Patents

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JPWO2022114210A5
JPWO2022114210A5 JP2022565502A JP2022565502A JPWO2022114210A5 JP WO2022114210 A5 JPWO2022114210 A5 JP WO2022114210A5 JP 2022565502 A JP2022565502 A JP 2022565502A JP 2022565502 A JP2022565502 A JP 2022565502A JP WO2022114210 A5 JPWO2022114210 A5 JP WO2022114210A5
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Japan
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energy beam
modeling
irradiating
irradiation
dimensional
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JP2022565502A
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Japanese (ja)
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JP7563481B2 (ja
JPWO2022114210A1 (https=
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Priority claimed from PCT/JP2021/043789 external-priority patent/WO2022114210A1/ja
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Publication of JPWO2022114210A5 publication Critical patent/JPWO2022114210A5/ja
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JP2022565502A 2020-11-30 2021-11-30 三次元造形装置及び三次元造形方法 Active JP7563481B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020198791 2020-11-30
JP2020198791 2020-11-30
PCT/JP2021/043789 WO2022114210A1 (ja) 2020-11-30 2021-11-30 三次元造形装置及び三次元造形方法

Publications (3)

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JPWO2022114210A1 JPWO2022114210A1 (https=) 2022-06-02
JPWO2022114210A5 true JPWO2022114210A5 (https=) 2023-08-02
JP7563481B2 JP7563481B2 (ja) 2024-10-08

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JP2022565502A Active JP7563481B2 (ja) 2020-11-30 2021-11-30 三次元造形装置及び三次元造形方法

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US (1) US20240017492A1 (https=)
EP (1) EP4253008A4 (https=)
JP (1) JP7563481B2 (https=)
CN (1) CN116472128A (https=)
WO (1) WO2022114210A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115489113B (zh) * 2022-09-27 2025-03-21 湖南华曙高科技股份有限公司 一种用于三维物体制造的激光扫描方法、装置和存储介质

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155324A (en) 1986-10-17 1992-10-13 Deckard Carl R Method for selective laser sintering with layerwise cross-scanning
JP3342125B2 (ja) * 1993-10-06 2002-11-05 シーメット株式会社 光硬化造形法における内部領域照射法
DE19649865C1 (de) * 1996-12-02 1998-02-12 Fraunhofer Ges Forschung Verfahren zur Herstellung eines Formkörpers
US8598523B2 (en) * 2009-11-13 2013-12-03 Sciaky, Inc. Electron beam layer manufacturing using scanning electron monitored closed loop control
CN104428084B (zh) * 2012-07-09 2016-08-31 松下知识产权经营株式会社 三维形状造型物的制造方法
EP2893994B1 (en) * 2014-01-14 2020-07-15 General Electric Technology GmbH Method for manufacturing a metallic or ceramic component by selective laser melting additive manufacturing
DE102014203711A1 (de) * 2014-02-28 2015-09-03 MTU Aero Engines AG Erzeugung von Druckeigenspannungen bei generativer Fertigung
EP3115182A4 (en) * 2014-03-05 2017-03-08 Panasonic Intellectual Property Management Co., Ltd. Method for producing three-dimensionally shaped object
GB201404854D0 (en) * 2014-03-18 2014-04-30 Renishaw Plc Selective solidification apparatus and method
GB201420717D0 (en) * 2014-11-21 2015-01-07 Renishaw Plc Additive manufacturing apparatus and methods
JP6732502B2 (ja) * 2016-03-31 2020-07-29 キヤノン株式会社 三次元造形方法、プログラム、記録媒体、及び三次元造形装置
WO2019088114A1 (ja) * 2017-10-31 2019-05-09 株式会社Ihi 三次元造形装置及び三次元造形方法
US10821721B2 (en) * 2017-11-27 2020-11-03 Arcam Ab Method for analysing a build layer
EP3542927A1 (de) * 2018-03-20 2019-09-25 Siemens Aktiengesellschaft Verfahren zum selektiven bestrahlen einer materialschicht, verfahren zum bereitstellen eines datensatzes, vorrichtung und computerprogrammprodukt
JP7206395B2 (ja) * 2018-12-27 2023-01-17 レイヤーワイズ エヌヴェ 複数のエネルギービームのための輪郭形成を最適化する三次元プリントシステム
US11396046B2 (en) * 2019-02-12 2022-07-26 General Electric Company Methods for additively manufacturing components with reduced build failures caused by temperature variations
EP3705211A1 (en) * 2019-03-05 2020-09-09 Siemens Aktiengesellschaft Method for heating a base material in additive manufacturing
EP3722075B1 (en) * 2019-04-08 2022-06-29 LayerWise N.V. Three-dimensional printing system optimizing seams between zones for multiple energy beams
JP7853255B2 (ja) * 2023-08-25 2026-04-28 日本電子株式会社 造形データ作成装置、三次元積層造形システム、及び、三次元積層造形方法

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