JPWO2022114020A1 - - Google Patents
Info
- Publication number
- JPWO2022114020A1 JPWO2022114020A1 JP2022565384A JP2022565384A JPWO2022114020A1 JP WO2022114020 A1 JPWO2022114020 A1 JP WO2022114020A1 JP 2022565384 A JP2022565384 A JP 2022565384A JP 2022565384 A JP2022565384 A JP 2022565384A JP WO2022114020 A1 JPWO2022114020 A1 JP WO2022114020A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023056259A JP7291864B1 (ja) | 2020-11-25 | 2023-03-30 | 発光装置 |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020195452 | 2020-11-25 | ||
JP2020195452 | 2020-11-25 | ||
JP2021061969 | 2021-03-31 | ||
JP2021061969 | 2021-03-31 | ||
JP2021065001 | 2021-04-06 | ||
JP2021065001 | 2021-04-06 | ||
PCT/JP2021/043037 WO2022114020A1 (ja) | 2020-11-25 | 2021-11-24 | 発光装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023056259A Division JP7291864B1 (ja) | 2020-11-25 | 2023-03-30 | 発光装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2022114020A1 true JPWO2022114020A1 (ja) | 2022-06-02 |
JP7266764B2 JP7266764B2 (ja) | 2023-04-28 |
JPWO2022114020A5 JPWO2022114020A5 (ja) | 2023-04-28 |
Family
ID=81755563
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022565384A Active JP7266764B2 (ja) | 2020-11-25 | 2021-11-24 | 発光装置 |
JP2023056259A Active JP7291864B1 (ja) | 2020-11-25 | 2023-03-30 | 発光装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023056259A Active JP7291864B1 (ja) | 2020-11-25 | 2023-03-30 | 発光装置 |
Country Status (3)
Country | Link |
---|---|
US (2) | US11855244B1 (ja) |
JP (2) | JP7266764B2 (ja) |
WO (1) | WO2022114020A1 (ja) |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002033517A (ja) * | 2000-05-09 | 2002-01-31 | Nichia Chem Ind Ltd | 発光素子とその製造方法 |
JP2005136378A (ja) * | 2003-10-08 | 2005-05-26 | Nichia Chem Ind Ltd | パッケージ成形体及び半導体装置 |
WO2007114306A1 (ja) * | 2006-03-29 | 2007-10-11 | Kyocera Corporation | 発光装置 |
JP2008159753A (ja) * | 2006-12-22 | 2008-07-10 | Nichia Chem Ind Ltd | 発光装置及びそれを用いたバックライト |
JP2011216891A (ja) * | 2010-04-01 | 2011-10-27 | Lg Innotek Co Ltd | 発光素子パッケージ及び照明システム |
JP2011228369A (ja) * | 2010-04-16 | 2011-11-10 | Nichia Chem Ind Ltd | 発光装置 |
CN102738356A (zh) * | 2011-04-07 | 2012-10-17 | 矽品精密工业股份有限公司 | 发光二极管封装结构 |
JP2015225942A (ja) * | 2014-05-28 | 2015-12-14 | サンケン電気株式会社 | 発光装置 |
JP2017204623A (ja) * | 2015-08-20 | 2017-11-16 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
JP2019020733A (ja) * | 2017-07-19 | 2019-02-07 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 複数の変換素子を製造する方法およびオプトエレクトロニクス構成素子 |
WO2020137855A1 (ja) * | 2018-12-28 | 2020-07-02 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5284006B2 (ja) | 2008-08-25 | 2013-09-11 | シチズン電子株式会社 | 発光装置 |
JP6048471B2 (ja) | 2014-10-01 | 2016-12-21 | 日亜化学工業株式会社 | 発光装置 |
US9859480B2 (en) | 2015-08-20 | 2018-01-02 | Nichia Corporation | Light emitting device and method of manufacturing light emitting device |
JP7240907B2 (ja) * | 2019-03-12 | 2023-03-16 | シチズン電子株式会社 | 発光装置及び発光装置の製造方法 |
-
2021
- 2021-11-24 US US18/038,815 patent/US11855244B1/en active Active
- 2021-11-24 JP JP2022565384A patent/JP7266764B2/ja active Active
- 2021-11-24 WO PCT/JP2021/043037 patent/WO2022114020A1/ja active Application Filing
-
2023
- 2023-03-30 JP JP2023056259A patent/JP7291864B1/ja active Active
- 2023-11-08 US US18/388,166 patent/US20240079539A1/en active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002033517A (ja) * | 2000-05-09 | 2002-01-31 | Nichia Chem Ind Ltd | 発光素子とその製造方法 |
JP2005136378A (ja) * | 2003-10-08 | 2005-05-26 | Nichia Chem Ind Ltd | パッケージ成形体及び半導体装置 |
WO2007114306A1 (ja) * | 2006-03-29 | 2007-10-11 | Kyocera Corporation | 発光装置 |
JP2008159753A (ja) * | 2006-12-22 | 2008-07-10 | Nichia Chem Ind Ltd | 発光装置及びそれを用いたバックライト |
JP2011216891A (ja) * | 2010-04-01 | 2011-10-27 | Lg Innotek Co Ltd | 発光素子パッケージ及び照明システム |
JP2011228369A (ja) * | 2010-04-16 | 2011-11-10 | Nichia Chem Ind Ltd | 発光装置 |
CN102738356A (zh) * | 2011-04-07 | 2012-10-17 | 矽品精密工业股份有限公司 | 发光二极管封装结构 |
JP2015225942A (ja) * | 2014-05-28 | 2015-12-14 | サンケン電気株式会社 | 発光装置 |
JP2017204623A (ja) * | 2015-08-20 | 2017-11-16 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
JP2019020733A (ja) * | 2017-07-19 | 2019-02-07 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 複数の変換素子を製造する方法およびオプトエレクトロニクス構成素子 |
WO2020137855A1 (ja) * | 2018-12-28 | 2020-07-02 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2023087689A (ja) | 2023-06-23 |
US20230395764A1 (en) | 2023-12-07 |
US20240079539A1 (en) | 2024-03-07 |
US11855244B1 (en) | 2023-12-26 |
JP7291864B1 (ja) | 2023-06-15 |
WO2022114020A1 (ja) | 2022-06-02 |
JP7266764B2 (ja) | 2023-04-28 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230222 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230222 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20230222 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230314 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230330 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230404 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230418 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7266764 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |