JPWO2022107217A1 - - Google Patents

Info

Publication number
JPWO2022107217A1
JPWO2022107217A1 JP2022508512A JP2022508512A JPWO2022107217A1 JP WO2022107217 A1 JPWO2022107217 A1 JP WO2022107217A1 JP 2022508512 A JP2022508512 A JP 2022508512A JP 2022508512 A JP2022508512 A JP 2022508512A JP WO2022107217 A1 JPWO2022107217 A1 JP WO2022107217A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022508512A
Other versions
JP7435739B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022107217A1 publication Critical patent/JPWO2022107217A1/ja
Application granted granted Critical
Publication of JP7435739B2 publication Critical patent/JP7435739B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2022508512A 2020-11-17 2020-11-17 研磨剤、複数液式研磨剤及び研磨方法 Active JP7435739B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/042834 WO2022107217A1 (ja) 2020-11-17 2020-11-17 研磨剤、複数液式研磨剤及び研磨方法

Publications (2)

Publication Number Publication Date
JPWO2022107217A1 true JPWO2022107217A1 (ja) 2022-05-27
JP7435739B2 JP7435739B2 (ja) 2024-02-21

Family

ID=81708507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022508512A Active JP7435739B2 (ja) 2020-11-17 2020-11-17 研磨剤、複数液式研磨剤及び研磨方法

Country Status (3)

Country Link
JP (1) JP7435739B2 (ja)
TW (1) TW202229499A (ja)
WO (1) WO2022107217A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012015352A (ja) * 2010-07-01 2012-01-19 Hitachi Chem Co Ltd Ｃｍｐ用研磨液及びこの研磨液を用いた研磨方法
JP2013120885A (ja) * 2011-12-08 2013-06-17 Hitachi Chemical Co Ltd Ｃｍｐ用研磨液及びこの研磨液を用いた研磨方法
US20130186850A1 (en) * 2012-01-24 2013-07-25 Applied Materials, Inc. Slurry for cobalt applications
WO2014007063A1 (ja) * 2012-07-06 2014-01-09 日立化成株式会社 Ｃｍｐ用研磨液、貯蔵液及び研磨方法
JP2015189829A (ja) * 2014-03-27 2015-11-02 株式会社フジミインコーポレーテッド 研磨用組成物
JP2017157591A (ja) * 2016-02-29 2017-09-07 日立化成株式会社 Ｃｍｐ研磨液及び研磨方法
JP2019520697A (ja) * 2016-04-27 2019-07-18 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ コバルト及び／又はコバルト合金を含む基板の研磨のための化学機械研磨（ｃｍｐ）組成物の使用方法
JP2020174176A (ja) * 2019-03-29 2020-10-22 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド コバルトの除去速度が高くコバルトのコロージョンが減少したコバルトのためのケミカルメカニカルポリッシング方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012015352A (ja) * 2010-07-01 2012-01-19 Hitachi Chem Co Ltd Ｃｍｐ用研磨液及びこの研磨液を用いた研磨方法
JP2013120885A (ja) * 2011-12-08 2013-06-17 Hitachi Chemical Co Ltd Ｃｍｐ用研磨液及びこの研磨液を用いた研磨方法
US20130186850A1 (en) * 2012-01-24 2013-07-25 Applied Materials, Inc. Slurry for cobalt applications
WO2014007063A1 (ja) * 2012-07-06 2014-01-09 日立化成株式会社 Ｃｍｐ用研磨液、貯蔵液及び研磨方法
JP2015189829A (ja) * 2014-03-27 2015-11-02 株式会社フジミインコーポレーテッド 研磨用組成物
JP2017157591A (ja) * 2016-02-29 2017-09-07 日立化成株式会社 Ｃｍｐ研磨液及び研磨方法
JP2019520697A (ja) * 2016-04-27 2019-07-18 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ コバルト及び／又はコバルト合金を含む基板の研磨のための化学機械研磨（ｃｍｐ）組成物の使用方法
JP2020174176A (ja) * 2019-03-29 2020-10-22 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド コバルトの除去速度が高くコバルトのコロージョンが減少したコバルトのためのケミカルメカニカルポリッシング方法

Also Published As

Publication number Publication date
JP7435739B2 (ja) 2024-02-21
WO2022107217A1 (ja) 2022-05-27
TW202229499A (zh) 2022-08-01

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