JPWO2022102226A1 - - Google Patents

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Publication number
JPWO2022102226A1
JPWO2022102226A1 JP2021572906A JP2021572906A JPWO2022102226A1 JP WO2022102226 A1 JPWO2022102226 A1 JP WO2022102226A1 JP 2021572906 A JP2021572906 A JP 2021572906A JP 2021572906 A JP2021572906 A JP 2021572906A JP WO2022102226 A1 JPWO2022102226 A1 JP WO2022102226A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021572906A
Other languages
Japanese (ja)
Other versions
JPWO2022102226A5 (en
JP7111410B1 (en
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Publication of JPWO2022102226A1 publication Critical patent/JPWO2022102226A1/ja
Application granted granted Critical
Publication of JP7111410B1 publication Critical patent/JP7111410B1/en
Publication of JPWO2022102226A5 publication Critical patent/JPWO2022102226A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP2021572906A 2020-11-10 2021-09-03 Electroless copper plating solution Active JP7111410B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020187294 2020-11-10
JP2020187294 2020-11-10
PCT/JP2021/032487 WO2022102226A1 (en) 2020-11-10 2021-09-03 Electroless copper plating solution

Publications (3)

Publication Number Publication Date
JPWO2022102226A1 true JPWO2022102226A1 (en) 2022-05-19
JP7111410B1 JP7111410B1 (en) 2022-08-02
JPWO2022102226A5 JPWO2022102226A5 (en) 2022-10-21

Family

ID=81601091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021572906A Active JP7111410B1 (en) 2020-11-10 2021-09-03 Electroless copper plating solution

Country Status (7)

Country Link
US (1) US20230323541A1 (en)
JP (1) JP7111410B1 (en)
KR (1) KR102587691B1 (en)
CN (1) CN116194618A (en)
DE (1) DE112021005992T5 (en)
TW (1) TW202219320A (en)
WO (1) WO2022102226A1 (en)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2721567A1 (en) * 1977-05-13 1978-11-16 Cannings Ltd W Tellerium-stabilised electroless copper plating soln. - by addition of tellurous or telluric acid or salt
JPS53142328A (en) * 1977-05-17 1978-12-12 Canning & Co Ltd W Solution for nonnelectrolytic copper plating
JP3227504B2 (en) * 1993-04-19 2001-11-12 奥野製薬工業株式会社 Electroless copper plating solution
JP2007092111A (en) * 2005-09-28 2007-04-12 Okuno Chem Ind Co Ltd Composition for preventing plating deposition
EP2034049A1 (en) * 2007-09-05 2009-03-11 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO An electroless process for depositing a metal on a non-catalytic substrate
JP6030848B2 (en) * 2012-05-07 2016-11-24 上村工業株式会社 Electroless copper plating bath and electroless copper plating method
JP5337276B1 (en) * 2012-05-07 2013-11-06 鹿島建設株式会社 Seismic isolation device support unit for reverse driving method and construction method of seismic isolation structure using the same
EP2784181B1 (en) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Electroless copper plating solution
WO2016097083A2 (en) * 2014-12-17 2016-06-23 Atotech Deutschland Gmbh Plating bath composition and method for electroless plating of palladium
KR101660520B1 (en) * 2015-04-08 2016-09-29 한국생산기술연구원 Method of performing continuous electroless plating of copper and nickel and plating layer using the same
US20170051411A1 (en) * 2015-08-20 2017-02-23 Macdermid Acumen, Inc. Electroless Silver Plating Bath and Method of Using the Same

Also Published As

Publication number Publication date
WO2022102226A1 (en) 2022-05-19
KR102587691B1 (en) 2023-10-10
TW202219320A (en) 2022-05-16
US20230323541A1 (en) 2023-10-12
DE112021005992T5 (en) 2023-08-24
JP7111410B1 (en) 2022-08-02
CN116194618A (en) 2023-05-30
KR20230011434A (en) 2023-01-20

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