JPWO2022097420A1 - - Google Patents

Info

Publication number
JPWO2022097420A1
JPWO2022097420A1 JP2022560685A JP2022560685A JPWO2022097420A1 JP WO2022097420 A1 JPWO2022097420 A1 JP WO2022097420A1 JP 2022560685 A JP2022560685 A JP 2022560685A JP 2022560685 A JP2022560685 A JP 2022560685A JP WO2022097420 A1 JPWO2022097420 A1 JP WO2022097420A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022560685A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022097420A1 publication Critical patent/JPWO2022097420A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Dicing (AREA)
JP2022560685A 2020-11-06 2021-10-08 Pending JPWO2022097420A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020185788 2020-11-06
PCT/JP2021/037348 WO2022097420A1 (ja) 2020-11-06 2021-10-08 半導体加工用粘着テープおよび半導体装置の製造方法

Publications (1)

Publication Number Publication Date
JPWO2022097420A1 true JPWO2022097420A1 (ko) 2022-05-12

Family

ID=81457144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022560685A Pending JPWO2022097420A1 (ko) 2020-11-06 2021-10-08

Country Status (3)

Country Link
JP (1) JPWO2022097420A1 (ko)
TW (1) TW202227571A (ko)
WO (1) WO2022097420A1 (ko)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250789A (ja) * 2006-03-15 2007-09-27 Shin Etsu Polymer Co Ltd 半導体ウエハの保護構造およびこれを用いた半導体ウエハの研削方法
JP5019619B2 (ja) * 2008-03-27 2012-09-05 古河電気工業株式会社 ウェハ表面保護テープ
JP2012209429A (ja) * 2011-03-30 2012-10-25 Furukawa Electric Co Ltd:The 半導体ウエハ加工用粘着テープ及び半導体ウエハの加工方法
KR102543780B1 (ko) * 2016-03-03 2023-06-14 린텍 가부시키가이샤 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법
WO2017149926A1 (ja) * 2016-03-04 2017-09-08 リンテック株式会社 半導体加工用シート
CN109743877B (zh) * 2016-10-03 2022-06-10 琳得科株式会社 半导体加工用粘着胶带以及半导体装置的制造方法
CN112334558B (zh) * 2018-06-26 2022-12-06 琳得科株式会社 半导体加工用粘着胶带及半导体装置的制造方法

Also Published As

Publication number Publication date
TW202227571A (zh) 2022-07-16
WO2022097420A1 (ja) 2022-05-12

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240722