JPWO2022097420A1 - - Google Patents
Info
- Publication number
- JPWO2022097420A1 JPWO2022097420A1 JP2022560685A JP2022560685A JPWO2022097420A1 JP WO2022097420 A1 JPWO2022097420 A1 JP WO2022097420A1 JP 2022560685 A JP2022560685 A JP 2022560685A JP 2022560685 A JP2022560685 A JP 2022560685A JP WO2022097420 A1 JPWO2022097420 A1 JP WO2022097420A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Adhesive Tapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020185788 | 2020-11-06 | ||
| PCT/JP2021/037348 WO2022097420A1 (ja) | 2020-11-06 | 2021-10-08 | 半導体加工用粘着テープおよび半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022097420A1 true JPWO2022097420A1 (ko) | 2022-05-12 |
Family
ID=81457144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022560685A Pending JPWO2022097420A1 (ko) | 2020-11-06 | 2021-10-08 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022097420A1 (ko) |
| TW (1) | TW202227571A (ko) |
| WO (1) | WO2022097420A1 (ko) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250789A (ja) * | 2006-03-15 | 2007-09-27 | Shin Etsu Polymer Co Ltd | 半導体ウエハの保護構造およびこれを用いた半導体ウエハの研削方法 |
| JP5019619B2 (ja) * | 2008-03-27 | 2012-09-05 | 古河電気工業株式会社 | ウェハ表面保護テープ |
| JP2012209429A (ja) * | 2011-03-30 | 2012-10-25 | Furukawa Electric Co Ltd:The | 半導体ウエハ加工用粘着テープ及び半導体ウエハの加工方法 |
| KR102543780B1 (ko) * | 2016-03-03 | 2023-06-14 | 린텍 가부시키가이샤 | 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법 |
| CN108243616B (zh) * | 2016-03-04 | 2022-10-28 | 琳得科株式会社 | 半导体加工用片 |
| US11183416B2 (en) * | 2016-10-03 | 2021-11-23 | Lintec Corporation | Adhesive tape for semiconductor processing, and semiconductor device manufacturing method |
| SG11202012963WA (en) * | 2018-06-26 | 2021-01-28 | Lintec Corp | Adhesive tape for semiconductor processing and method for producing semiconductor device |
-
2021
- 2021-10-08 JP JP2022560685A patent/JPWO2022097420A1/ja active Pending
- 2021-10-08 WO PCT/JP2021/037348 patent/WO2022097420A1/ja active Application Filing
- 2021-10-18 TW TW110138527A patent/TW202227571A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022097420A1 (ja) | 2022-05-12 |
| TW202227571A (zh) | 2022-07-16 |