JPWO2022085475A1 - - Google Patents

Info

Publication number
JPWO2022085475A1
JPWO2022085475A1 JP2022556892A JP2022556892A JPWO2022085475A1 JP WO2022085475 A1 JPWO2022085475 A1 JP WO2022085475A1 JP 2022556892 A JP2022556892 A JP 2022556892A JP 2022556892 A JP2022556892 A JP 2022556892A JP WO2022085475 A1 JPWO2022085475 A1 JP WO2022085475A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022556892A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022085475A1 publication Critical patent/JPWO2022085475A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/96—Esters of carbonic or haloformic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/134—Phenols containing ester groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/24—Derivatives of hydrazine
    • C08K5/25—Carboxylic acid hydrazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022556892A 2020-10-21 2021-10-07 Pending JPWO2022085475A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020176962 2020-10-21
PCT/JP2021/037246 WO2022085475A1 (en) 2020-10-21 2021-10-07 Composition, cured product, method for producing cured product, and additive

Publications (1)

Publication Number Publication Date
JPWO2022085475A1 true JPWO2022085475A1 (en) 2022-04-28

Family

ID=81290359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022556892A Pending JPWO2022085475A1 (en) 2020-10-21 2021-10-07

Country Status (5)

Country Link
JP (1) JPWO2022085475A1 (en)
KR (1) KR20230091872A (en)
CN (1) CN116368122A (en)
TW (1) TW202222892A (en)
WO (1) WO2022085475A1 (en)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3888823A (en) * 1972-10-13 1975-06-10 Cincinnati Milacron Inc Methoxy carboxylic acid ester ultraviolet stabilizers for polymers
JPH0643630A (en) * 1991-05-28 1994-02-18 Nippon Kayaku Co Ltd Acid-decomposable compound and positive type radiation sensitive resist composition containing same
US5556973A (en) * 1994-07-27 1996-09-17 Ciba-Geigy Corporation Red-shifted tris-aryl-s-triazines and compositions stabilized therewith
JP3637277B2 (en) * 2000-03-21 2005-04-13 大塚化学ホールディングス株式会社 Flame retardant, flame retardant resin composition, molded product, and electronic component
JP2002188077A (en) * 2000-10-10 2002-07-05 Fuji Photo Film Co Ltd Composition containing precursor of ultraviolet absorber, and method for forming image
JP2004157231A (en) * 2002-11-05 2004-06-03 Konica Minolta Holdings Inc Dry imaging material
KR20060017934A (en) * 2004-08-23 2006-02-28 미원상사주식회사 Positive type photosensitive composition for pre-sensitized plate and developing solution for the same
TWI494697B (en) * 2004-12-24 2015-08-01 Mitsubishi Gas Chemical Co Resist compound
JP2008111102A (en) * 2006-10-02 2008-05-15 Shin Etsu Chem Co Ltd Flame-retardant adhesive composition, and adhesive sheet, cover-lay film and flexible copper-clad laminate using the same
KR20080030934A (en) * 2006-10-02 2008-04-07 신에쓰 가가꾸 고교 가부시끼가이샤 Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
CN102325819B (en) * 2009-02-21 2014-11-12 索尼化学&信息部件株式会社 Starting liquid for forming protective film, protective film, and wired substrate having protective film
EP3753997A1 (en) * 2012-07-31 2020-12-23 Adeka Corporation Latent additive and composition containing latent additive
JP2015163671A (en) * 2013-12-13 2015-09-10 株式会社Adeka Radical-polymerizable composition
JP2016038569A (en) * 2014-08-05 2016-03-22 株式会社Adeka Photosensitive composition
JP6389751B2 (en) * 2014-12-05 2018-09-12 新日鉄住金化学株式会社 Hydroxy resin, production method thereof, epoxy resin composition and cured product thereof
CN107614509B (en) * 2015-05-28 2020-05-12 大塚化学株式会社 Allylphenoxycyclophosphazene compound and method for producing same
JP2019191303A (en) 2018-04-20 2019-10-31 積水化学工業株式会社 Curable composition, electronic component, method for producing electronic component
WO2020054719A1 (en) * 2018-09-14 2020-03-19 富士フイルム株式会社 Near-infrared-absorbent photosensitive composition, cured film, optical filter, pattern formation method, layered body, solid-state imaging element, image display device, and infrared sensor
JP7436176B2 (en) * 2018-10-25 2024-02-21 株式会社Adeka Composition, solder resist composition, cured product, and method for producing cured product

Also Published As

Publication number Publication date
CN116368122A (en) 2023-06-30
WO2022085475A1 (en) 2022-04-28
TW202222892A (en) 2022-06-16
KR20230091872A (en) 2023-06-23

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Legal Events

Date Code Title Description
A621 Written request for application examination

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Effective date: 20240920