JPWO2022080403A1 - - Google Patents

Info

Publication number
JPWO2022080403A1
JPWO2022080403A1 JP2022557036A JP2022557036A JPWO2022080403A1 JP WO2022080403 A1 JPWO2022080403 A1 JP WO2022080403A1 JP 2022557036 A JP2022557036 A JP 2022557036A JP 2022557036 A JP2022557036 A JP 2022557036A JP WO2022080403 A1 JPWO2022080403 A1 JP WO2022080403A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022557036A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022080403A1 publication Critical patent/JPWO2022080403A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
JP2022557036A 2020-10-16 2021-10-13 Pending JPWO2022080403A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020174699 2020-10-16
PCT/JP2021/037857 WO2022080403A1 (ja) 2020-10-16 2021-10-13 熱硬化性組成物およびその用途

Publications (1)

Publication Number Publication Date
JPWO2022080403A1 true JPWO2022080403A1 (https=) 2022-04-21

Family

ID=81209149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022557036A Pending JPWO2022080403A1 (https=) 2020-10-16 2021-10-13

Country Status (3)

Country Link
JP (1) JPWO2022080403A1 (https=)
TW (1) TW202227555A (https=)
WO (1) WO2022080403A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024011810A (ja) * 2022-07-15 2024-01-25 信越化学工業株式会社 熱硬化性樹脂組成物、熱硬化性樹脂組成物を用いたプリプレグ、及び熱硬化性樹脂組成物の硬化物を有する基板
WO2025203802A1 (ja) * 2024-03-27 2025-10-02 大阪ガスケミカル株式会社 フルオレン化合物とその製造方法および用途

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005162785A (ja) * 2003-11-28 2005-06-23 Osaka Gas Co Ltd フルオレン骨格含有樹脂組成物およびその成形体
JP2007501876A (ja) * 2003-08-07 2007-02-01 ゼネラル・エレクトリック・カンパニイ 熱硬化性組成物、その製造方法及び製品
JP2014218659A (ja) * 2013-04-10 2014-11-20 大阪瓦斯株式会社 強度向上剤
CN106633035A (zh) * 2016-12-17 2017-05-10 衢州普信新材料有限公司 一种用作聚酰胺助剂的聚醚化合物的制备方法
US20170174835A1 (en) * 2015-12-18 2017-06-22 Elite Electronic Material (Kunshan) Co., Ltd. Fluorenylidene-diphenol-containing polyphenylene oxide
CN107163244A (zh) * 2016-03-07 2017-09-15 江苏和成新材料有限公司 覆铜板用聚苯醚树脂
JP2020136546A (ja) * 2019-02-21 2020-08-31 パナソニックＩｐマネジメント株式会社 封止用材料、積層シート、硬化物、半導体装置、及び半導体装置の製造方法
JP2021031530A (ja) * 2019-08-20 2021-03-01 信越化学工業株式会社 熱硬化性樹脂組成物、並びにこれを用いた接着剤、フィルム、プリプレグ、積層板、回路基板及びプリント配線板
WO2021153315A1 (ja) * 2020-01-31 2021-08-05 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
WO2021166847A1 (ja) * 2020-02-18 2021-08-26 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、樹脂シート、樹脂付き金属箔、金属張積層板及びプリント配線板
JP2021127438A (ja) * 2020-02-17 2021-09-02 信越化学工業株式会社 熱硬化性樹脂組成物、熱硬化性接着剤、熱硬化性樹脂フィルム並びに前記熱硬化性樹脂組成物を用いた積層板、プリプレグ、及び回路基板

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007501876A (ja) * 2003-08-07 2007-02-01 ゼネラル・エレクトリック・カンパニイ 熱硬化性組成物、その製造方法及び製品
JP2005162785A (ja) * 2003-11-28 2005-06-23 Osaka Gas Co Ltd フルオレン骨格含有樹脂組成物およびその成形体
JP2014218659A (ja) * 2013-04-10 2014-11-20 大阪瓦斯株式会社 強度向上剤
US20170174835A1 (en) * 2015-12-18 2017-06-22 Elite Electronic Material (Kunshan) Co., Ltd. Fluorenylidene-diphenol-containing polyphenylene oxide
CN107163244A (zh) * 2016-03-07 2017-09-15 江苏和成新材料有限公司 覆铜板用聚苯醚树脂
CN106633035A (zh) * 2016-12-17 2017-05-10 衢州普信新材料有限公司 一种用作聚酰胺助剂的聚醚化合物的制备方法
JP2020136546A (ja) * 2019-02-21 2020-08-31 パナソニックＩｐマネジメント株式会社 封止用材料、積層シート、硬化物、半導体装置、及び半導体装置の製造方法
JP2021031530A (ja) * 2019-08-20 2021-03-01 信越化学工業株式会社 熱硬化性樹脂組成物、並びにこれを用いた接着剤、フィルム、プリプレグ、積層板、回路基板及びプリント配線板
WO2021153315A1 (ja) * 2020-01-31 2021-08-05 京セラ株式会社 樹脂組成物、プリプレグ、金属張積層板および配線基板
JP2021127438A (ja) * 2020-02-17 2021-09-02 信越化学工業株式会社 熱硬化性樹脂組成物、熱硬化性接着剤、熱硬化性樹脂フィルム並びに前記熱硬化性樹脂組成物を用いた積層板、プリプレグ、及び回路基板
WO2021166847A1 (ja) * 2020-02-18 2021-08-26 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、樹脂シート、樹脂付き金属箔、金属張積層板及びプリント配線板

Also Published As

Publication number Publication date
WO2022080403A1 (ja) 2022-04-21
TW202227555A (zh) 2022-07-16

Similar Documents

Publication Publication Date Title
BR112023005462A2 (https=)
BR112023012656A2 (https=)
BR112021014123A2 (https=)
BR112023009656A2 (https=)
BR112022009896A2 (https=)
BR112021017747A2 (https=)
JPWO2021153315A1 (https=)
BR112022024743A2 (https=)
BR112022026905A2 (https=)
BR112023011738A2 (https=)
BR112023004146A2 (https=)
BR112023006729A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
BR102021007058A2 (https=)
BR102020022030A2 (https=)
BR112023016292A2 (https=)
BR112023011539A2 (https=)
BR112023011610A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)
BR102021016551A2 (https=)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240425

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250624

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250805

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20251125

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20260120