JPWO2022074952A1 - - Google Patents

Info

Publication number
JPWO2022074952A1
JPWO2022074952A1 JP2022555295A JP2022555295A JPWO2022074952A1 JP WO2022074952 A1 JPWO2022074952 A1 JP WO2022074952A1 JP 2022555295 A JP2022555295 A JP 2022555295A JP 2022555295 A JP2022555295 A JP 2022555295A JP WO2022074952 A1 JPWO2022074952 A1 JP WO2022074952A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022555295A
Other languages
Japanese (ja)
Other versions
JP7479498B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022074952A1 publication Critical patent/JPWO2022074952A1/ja
Application granted granted Critical
Publication of JP7479498B2 publication Critical patent/JP7479498B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2022555295A 2020-10-05 2021-08-25 半導体試験装置および半導体試験方法 Active JP7479498B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020168349 2020-10-05
JP2020168349 2020-10-05
PCT/JP2021/031177 WO2022074952A1 (ja) 2020-10-05 2021-08-25 半導体試験装置および半導体試験方法

Publications (2)

Publication Number Publication Date
JPWO2022074952A1 true JPWO2022074952A1 (enrdf_load_stackoverflow) 2022-04-14
JP7479498B2 JP7479498B2 (ja) 2024-05-08

Family

ID=81125779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022555295A Active JP7479498B2 (ja) 2020-10-05 2021-08-25 半導体試験装置および半導体試験方法

Country Status (3)

Country Link
JP (1) JP7479498B2 (enrdf_load_stackoverflow)
CN (1) CN116325104A (enrdf_load_stackoverflow)
WO (1) WO2022074952A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024106052A1 (ja) * 2022-11-17 2024-05-23 三菱電機株式会社 半導体試験装置、半導体試験方法および半導体装置の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233437U (enrdf_load_stackoverflow) * 1988-08-26 1990-03-02
JP2006071467A (ja) * 2004-09-02 2006-03-16 Toyota Industries Corp 半導体チップの電気特性測定方法及び装置
JP2011138865A (ja) * 2009-12-28 2011-07-14 Micronics Japan Co Ltd 半導体デバイスの検査装置
JP2012151323A (ja) * 2011-01-20 2012-08-09 Toshiba Corp 半導体装置およびその製造方法
JP2014036105A (ja) * 2012-08-08 2014-02-24 Mitsubishi Electric Corp 半導体装置の測定方法、測定器
JP2018179618A (ja) * 2017-04-06 2018-11-15 トヨタ自動車株式会社 半導体素子の検査装置
JP2019125642A (ja) * 2018-01-15 2019-07-25 信越半導体株式会社 半導体装置の評価装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233437U (enrdf_load_stackoverflow) * 1988-08-26 1990-03-02
JP2006071467A (ja) * 2004-09-02 2006-03-16 Toyota Industries Corp 半導体チップの電気特性測定方法及び装置
JP2011138865A (ja) * 2009-12-28 2011-07-14 Micronics Japan Co Ltd 半導体デバイスの検査装置
JP2012151323A (ja) * 2011-01-20 2012-08-09 Toshiba Corp 半導体装置およびその製造方法
JP2014036105A (ja) * 2012-08-08 2014-02-24 Mitsubishi Electric Corp 半導体装置の測定方法、測定器
JP2018179618A (ja) * 2017-04-06 2018-11-15 トヨタ自動車株式会社 半導体素子の検査装置
JP2019125642A (ja) * 2018-01-15 2019-07-25 信越半導体株式会社 半導体装置の評価装置

Also Published As

Publication number Publication date
CN116325104A (zh) 2023-06-23
WO2022074952A1 (ja) 2022-04-14
JP7479498B2 (ja) 2024-05-08

Similar Documents

Publication Publication Date Title
BR112023005462A2 (enrdf_load_stackoverflow)
BR112023012656A2 (enrdf_load_stackoverflow)
BR112021014123A2 (enrdf_load_stackoverflow)
BR112023009656A2 (enrdf_load_stackoverflow)
BR112022009896A2 (enrdf_load_stackoverflow)
BR112023008622A2 (enrdf_load_stackoverflow)
BR112022024743A2 (enrdf_load_stackoverflow)
BR112022026905A2 (enrdf_load_stackoverflow)
BR112023011738A2 (enrdf_load_stackoverflow)
BR112023004146A2 (enrdf_load_stackoverflow)
BR112023006729A2 (enrdf_load_stackoverflow)
BR102021018859A2 (enrdf_load_stackoverflow)
BR102021015500A2 (enrdf_load_stackoverflow)
BR112021017747A2 (enrdf_load_stackoverflow)
BR102021007058A2 (enrdf_load_stackoverflow)
BR102020022030A2 (enrdf_load_stackoverflow)
BR112023016292A2 (enrdf_load_stackoverflow)
BR112023011539A2 (enrdf_load_stackoverflow)
BR112023011610A2 (enrdf_load_stackoverflow)
BR112023008976A2 (enrdf_load_stackoverflow)
BR102021020147A2 (enrdf_load_stackoverflow)
BR102021018926A2 (enrdf_load_stackoverflow)
BR102021018167A2 (enrdf_load_stackoverflow)
BR102021017576A2 (enrdf_load_stackoverflow)
BR102021016837A2 (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230112

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240326

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240423

R150 Certificate of patent or registration of utility model

Ref document number: 7479498

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150