JPWO2022070801A1 - - Google Patents
Info
- Publication number
- JPWO2022070801A1 JPWO2022070801A1 JP2022553734A JP2022553734A JPWO2022070801A1 JP WO2022070801 A1 JPWO2022070801 A1 JP WO2022070801A1 JP 2022553734 A JP2022553734 A JP 2022553734A JP 2022553734 A JP2022553734 A JP 2022553734A JP WO2022070801 A1 JPWO2022070801 A1 JP WO2022070801A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020163194 | 2020-09-29 | ||
| PCT/JP2021/032804 WO2022070801A1 (en) | 2020-09-29 | 2021-09-07 | Grinding composition and use thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022070801A1 true JPWO2022070801A1 (en) | 2022-04-07 |
Family
ID=80950145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022553734A Pending JPWO2022070801A1 (en) | 2020-09-29 | 2021-09-07 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022070801A1 (en) |
| TW (1) | TW202220046A (en) |
| WO (1) | WO2022070801A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024029457A1 (en) * | 2022-08-05 | 2024-02-08 | 株式会社フジミインコーポレーテッド | Polishing composition |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6936543B2 (en) * | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
| KR100827591B1 (en) * | 2006-11-27 | 2008-05-07 | 제일모직주식회사 | Chemical mechanical polishing slurry compositions and the precursor composition of the same |
| JP2011162614A (en) * | 2010-02-05 | 2011-08-25 | Canon Inc | Inkjet ink and method for manufacturing the inkjet ink |
| SG11201700255UA (en) * | 2014-07-15 | 2017-02-27 | Basf Se | A chemical mechanical polishing (cmp) composition |
| JP2020105095A (en) * | 2018-12-27 | 2020-07-09 | 小林製薬株式会社 | Composition for oral cavity |
-
2021
- 2021-09-07 JP JP2022553734A patent/JPWO2022070801A1/ja active Pending
- 2021-09-07 WO PCT/JP2021/032804 patent/WO2022070801A1/en active Application Filing
- 2021-09-24 TW TW110135602A patent/TW202220046A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022070801A1 (en) | 2022-04-07 |
| TW202220046A (en) | 2022-05-16 |