JPWO2022113986A1 - - Google Patents
Info
- Publication number
- JPWO2022113986A1 JPWO2022113986A1 JP2022565362A JP2022565362A JPWO2022113986A1 JP WO2022113986 A1 JPWO2022113986 A1 JP WO2022113986A1 JP 2022565362 A JP2022565362 A JP 2022565362A JP 2022565362 A JP2022565362 A JP 2022565362A JP WO2022113986 A1 JPWO2022113986 A1 JP WO2022113986A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020198395 | 2020-11-30 | ||
PCT/JP2021/042940 WO2022113986A1 (en) | 2020-11-30 | 2021-11-24 | Polishing composition for silicon wafers and use thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022113986A1 true JPWO2022113986A1 (en) | 2022-06-02 |
Family
ID=81755564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022565362A Pending JPWO2022113986A1 (en) | 2020-11-30 | 2021-11-24 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2022113986A1 (en) |
TW (1) | TW202231830A (en) |
WO (1) | WO2022113986A1 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007273642A (en) * | 2006-03-30 | 2007-10-18 | Fujifilm Corp | Polishing liquid for metal and polishing method using same |
US8916061B2 (en) * | 2012-03-14 | 2014-12-23 | Cabot Microelectronics Corporation | CMP compositions selective for oxide and nitride with high removal rate and low defectivity |
JP6761554B1 (en) * | 2020-01-22 | 2020-09-23 | 日本酢ビ・ポバール株式会社 | Polishing composition |
-
2021
- 2021-11-24 WO PCT/JP2021/042940 patent/WO2022113986A1/en active Application Filing
- 2021-11-24 JP JP2022565362A patent/JPWO2022113986A1/ja active Pending
- 2021-11-29 TW TW110144397A patent/TW202231830A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW202231830A (en) | 2022-08-16 |
WO2022113986A1 (en) | 2022-06-02 |