JPWO2022065022A1 - - Google Patents

Info

Publication number
JPWO2022065022A1
JPWO2022065022A1 JP2022551846A JP2022551846A JPWO2022065022A1 JP WO2022065022 A1 JPWO2022065022 A1 JP WO2022065022A1 JP 2022551846 A JP2022551846 A JP 2022551846A JP 2022551846 A JP2022551846 A JP 2022551846A JP WO2022065022 A1 JPWO2022065022 A1 JP WO2022065022A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022551846A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022065022A1 publication Critical patent/JPWO2022065022A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2022551846A 2020-09-24 2021-09-07 Pending JPWO2022065022A1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020159302 2020-09-24
PCT/JP2021/032805 WO2022065022A1 (ja) 2020-09-24 2021-09-07 研磨用組成物およびその利用

Publications (1)

Publication Number Publication Date
JPWO2022065022A1 true JPWO2022065022A1 (enExample) 2022-03-31

Family

ID=80845288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022551846A Pending JPWO2022065022A1 (enExample) 2020-09-24 2021-09-07

Country Status (3)

Country Link
JP (1) JPWO2022065022A1 (enExample)
TW (1) TW202219234A (enExample)
WO (1) WO2022065022A1 (enExample)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104559797A (zh) * 2014-12-22 2015-04-29 深圳市力合材料有限公司 一种硅晶片细抛光组合物及其制备方法
JP2017025231A (ja) * 2015-07-24 2017-02-02 株式会社Adeka 研磨液組成物及び研磨方法
WO2018131341A1 (ja) * 2017-01-11 2018-07-19 株式会社フジミインコーポレーテッド 研磨用組成物
JP2018532828A (ja) * 2015-09-03 2018-11-08 キャボット マイクロエレクトロニクス コーポレイション 誘電体基板を加工するための方法及び組成物
JP2019119782A (ja) * 2017-12-28 2019-07-22 花王株式会社 研磨液組成物
CN111040640A (zh) * 2020-01-07 2020-04-21 郑州中科新兴产业技术研究院 用于硅晶圆基材的复合磨料化学机械抛光浆料及制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104559797A (zh) * 2014-12-22 2015-04-29 深圳市力合材料有限公司 一种硅晶片细抛光组合物及其制备方法
JP2017025231A (ja) * 2015-07-24 2017-02-02 株式会社Adeka 研磨液組成物及び研磨方法
JP2018532828A (ja) * 2015-09-03 2018-11-08 キャボット マイクロエレクトロニクス コーポレイション 誘電体基板を加工するための方法及び組成物
WO2018131341A1 (ja) * 2017-01-11 2018-07-19 株式会社フジミインコーポレーテッド 研磨用組成物
JP2019119782A (ja) * 2017-12-28 2019-07-22 花王株式会社 研磨液組成物
CN111040640A (zh) * 2020-01-07 2020-04-21 郑州中科新兴产业技术研究院 用于硅晶圆基材的复合磨料化学机械抛光浆料及制备方法

Also Published As

Publication number Publication date
WO2022065022A1 (ja) 2022-03-31
TW202219234A (zh) 2022-05-16

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