JPWO2022059517A1 - - Google Patents

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Publication number
JPWO2022059517A1
JPWO2022059517A1 JP2022517800A JP2022517800A JPWO2022059517A1 JP WO2022059517 A1 JPWO2022059517 A1 JP WO2022059517A1 JP 2022517800 A JP2022517800 A JP 2022517800A JP 2022517800 A JP2022517800 A JP 2022517800A JP WO2022059517 A1 JPWO2022059517 A1 JP WO2022059517A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022517800A
Other versions
JP7173402B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022059517A1 publication Critical patent/JPWO2022059517A1/ja
Application granted granted Critical
Publication of JP7173402B2 publication Critical patent/JP7173402B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2225/00—Reinforcing means
    • F28F2225/04—Reinforcing means for conduits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2022517800A 2020-09-18 2021-09-03 ベーパーチャンバー Active JP7173402B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020157487 2020-09-18
JP2020157487 2020-09-18
PCT/JP2021/032412 WO2022059517A1 (ja) 2020-09-18 2021-09-03 ベーパーチャンバー

Publications (2)

Publication Number Publication Date
JPWO2022059517A1 true JPWO2022059517A1 (ja) 2022-03-24
JP7173402B2 JP7173402B2 (ja) 2022-11-16

Family

ID=80776972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022517800A Active JP7173402B2 (ja) 2020-09-18 2021-09-03 ベーパーチャンバー

Country Status (4)

Country Link
US (1) US20230217631A1 (ja)
JP (1) JP7173402B2 (ja)
CN (1) CN219736078U (ja)
WO (1) WO2022059517A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4203636A4 (en) * 2020-11-23 2024-02-28 Samsung Electronics Co Ltd HEAT DIFFUSION STRUCTURE AND ELECTRONIC DEVICE COMPRISING IT

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108050A (en) * 1978-02-13 1979-08-24 Oki Electric Cable Flat board type heat pipe
JP2004309002A (ja) * 2003-04-04 2004-11-04 Hitachi Cable Ltd プレート型ヒートパイプおよびその製造方法
US20120145357A1 (en) * 2010-12-13 2012-06-14 Electronics And Telecommunications Research Institute Thin plate heat pipe
JP2015092131A (ja) * 2009-04-21 2015-05-14 ユナ ティーアンドイー カンパニーリミテッドＹｏｕｎａ Ｔ＆Ｅ Ｃｏ．，Ｌｔｄ． 太陽光モジュールの冷却装置
CN207881538U (zh) * 2017-11-03 2018-09-18 中国科学院理化技术研究所 一种平板热管
KR20200056917A (ko) * 2018-11-15 2020-05-25 주식회사 씨지아이 윅 장착형 무방향성 베이퍼 챔버

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108050A (en) * 1978-02-13 1979-08-24 Oki Electric Cable Flat board type heat pipe
JP2004309002A (ja) * 2003-04-04 2004-11-04 Hitachi Cable Ltd プレート型ヒートパイプおよびその製造方法
JP2015092131A (ja) * 2009-04-21 2015-05-14 ユナ ティーアンドイー カンパニーリミテッドＹｏｕｎａ Ｔ＆Ｅ Ｃｏ．，Ｌｔｄ． 太陽光モジュールの冷却装置
US20120145357A1 (en) * 2010-12-13 2012-06-14 Electronics And Telecommunications Research Institute Thin plate heat pipe
CN207881538U (zh) * 2017-11-03 2018-09-18 中国科学院理化技术研究所 一种平板热管
KR20200056917A (ko) * 2018-11-15 2020-05-25 주식회사 씨지아이 윅 장착형 무방향성 베이퍼 챔버

Also Published As

Publication number Publication date
WO2022059517A1 (ja) 2022-03-24
US20230217631A1 (en) 2023-07-06
CN219736078U (zh) 2023-09-22
JP7173402B2 (ja) 2022-11-16

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