JPWO2022054374A1 - - Google Patents

Info

Publication number
JPWO2022054374A1
JPWO2022054374A1 JP2022547409A JP2022547409A JPWO2022054374A1 JP WO2022054374 A1 JPWO2022054374 A1 JP WO2022054374A1 JP 2022547409 A JP2022547409 A JP 2022547409A JP 2022547409 A JP2022547409 A JP 2022547409A JP WO2022054374 A1 JPWO2022054374 A1 JP WO2022054374A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022547409A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022054374A1 publication Critical patent/JPWO2022054374A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
JP2022547409A 2020-09-14 2021-06-25 Pending JPWO2022054374A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020153896 2020-09-14
JP2020207814 2020-12-15
PCT/JP2021/024174 WO2022054374A1 (en) 2020-09-14 2021-06-25 Photosensitive transfer material, production method for resin pattern, production method for circuit wiring, and production method for electronic device

Publications (1)

Publication Number Publication Date
JPWO2022054374A1 true JPWO2022054374A1 (en) 2022-03-17

Family

ID=80632257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022547409A Pending JPWO2022054374A1 (en) 2020-09-14 2021-06-25

Country Status (3)

Country Link
JP (1) JPWO2022054374A1 (en)
CN (1) CN116249939A (en)
WO (1) WO2022054374A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008239743A (en) * 2007-03-27 2008-10-09 Toray Ind Inc Polyester film for dry film resist carrier
JP2009073022A (en) * 2007-09-20 2009-04-09 Fujifilm Corp Laminated material for transfer and image forming method
JP2009083482A (en) * 2007-09-13 2009-04-23 Asahi Kasei Electronics Co Ltd Photosensitive resin laminate
JP2017177546A (en) * 2016-03-30 2017-10-05 富士フイルム株式会社 Transfer film, electrode protective film of capacitance type input device, laminate and capacitance type input device
WO2020054660A1 (en) * 2018-09-12 2020-03-19 富士フイルム株式会社 Photosensitive transfer material, method for producing circuit wiring line, method for producing touch panel, method for producing resin pattern, and film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007264483A (en) * 2006-03-29 2007-10-11 Fujifilm Corp Pattern forming material and pattern forming method
JP2010032609A (en) * 2008-07-25 2010-02-12 Teijin Dupont Films Japan Ltd Polyester film for dry film photoresist
JPWO2021033451A1 (en) * 2019-08-22 2021-02-25

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008239743A (en) * 2007-03-27 2008-10-09 Toray Ind Inc Polyester film for dry film resist carrier
JP2009083482A (en) * 2007-09-13 2009-04-23 Asahi Kasei Electronics Co Ltd Photosensitive resin laminate
JP2009073022A (en) * 2007-09-20 2009-04-09 Fujifilm Corp Laminated material for transfer and image forming method
JP2017177546A (en) * 2016-03-30 2017-10-05 富士フイルム株式会社 Transfer film, electrode protective film of capacitance type input device, laminate and capacitance type input device
WO2020054660A1 (en) * 2018-09-12 2020-03-19 富士フイルム株式会社 Photosensitive transfer material, method for producing circuit wiring line, method for producing touch panel, method for producing resin pattern, and film

Also Published As

Publication number Publication date
WO2022054374A1 (en) 2022-03-17
CN116249939A (en) 2023-06-09

Similar Documents

Publication Publication Date Title
BR112023012656A2 (en)
BR102021007058A2 (en)
JPWO2021172455A1 (en)
JPWO2021192608A1 (en)
JPWO2021153283A1 (en)
BR102020022030A2 (en)
BR112023011738A2 (en)
BR112023016292A2 (en)
BR112023011610A2 (en)
BR112023011539A2 (en)
BR112023008976A2 (en)
BR112023009656A2 (en)
BR112023006729A2 (en)
JPWO2022045255A1 (en)
BR102021016551A2 (en)
JPWO2022044879A1 (en)
BR102021015450A8 (en)
BR102021015247A2 (en)
BR102021015220A2 (en)
BR102021014044A2 (en)
BR102021014056A2 (en)
BR102021013929A2 (en)
JPWO2022054374A1 (en)
BR102021012571A2 (en)
BR102021012230A2 (en)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20221026

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230620

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230815

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20231031