JPWO2022050117A1 - - Google Patents

Info

Publication number
JPWO2022050117A1
JPWO2022050117A1 JP2022546250A JP2022546250A JPWO2022050117A1 JP WO2022050117 A1 JPWO2022050117 A1 JP WO2022050117A1 JP 2022546250 A JP2022546250 A JP 2022546250A JP 2022546250 A JP2022546250 A JP 2022546250A JP WO2022050117 A1 JPWO2022050117 A1 JP WO2022050117A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022546250A
Other languages
Japanese (ja)
Other versions
JP7405268B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022050117A1 publication Critical patent/JPWO2022050117A1/ja
Application granted granted Critical
Publication of JP7405268B2 publication Critical patent/JP7405268B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2022546250A 2020-09-04 2021-08-23 Substrate processing equipment and substrate processing method Active JP7405268B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020149320 2020-09-04
JP2020149320 2020-09-04
PCT/JP2021/030857 WO2022050117A1 (en) 2020-09-04 2021-08-23 Substrate processing device and substrate processing method

Publications (2)

Publication Number Publication Date
JPWO2022050117A1 true JPWO2022050117A1 (en) 2022-03-10
JP7405268B2 JP7405268B2 (en) 2023-12-26

Family

ID=80490891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022546250A Active JP7405268B2 (en) 2020-09-04 2021-08-23 Substrate processing equipment and substrate processing method

Country Status (5)

Country Link
JP (1) JP7405268B2 (en)
KR (1) KR20230056036A (en)
CN (1) CN116018214A (en)
TW (1) TW202215500A (en)
WO (1) WO2022050117A1 (en)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249433A (en) 2002-02-25 2003-09-05 Seiko Epson Corp Exposure system and exposure controlling method
JP4363593B2 (en) 2003-05-14 2009-11-11 東京エレクトロン株式会社 Thin film removal equipment
JP4312145B2 (en) 2004-11-15 2009-08-12 大日本スクリーン製造株式会社 Substrate position correction apparatus and substrate position correction method
JP5398785B2 (en) 2011-06-20 2014-01-29 株式会社東芝 Spiral coating apparatus and spiral coating method
JP2013102053A (en) 2011-11-08 2013-05-23 Tokyo Electron Ltd Substrate processing system, substrate transfer method, program, and computer storage medium
JP6516825B2 (en) 2014-06-04 2019-05-22 東京エレクトロン株式会社 Liquid application method, liquid application apparatus, and computer readable recording medium
CN108028177B (en) 2015-09-15 2022-10-21 东京毅力科创株式会社 Substrate processing apparatus, substrate processing method, and storage medium
JP6815799B2 (en) 2016-09-13 2021-01-20 東京エレクトロン株式会社 Substrate processing equipment and substrate processing method
JP7024307B2 (en) 2017-01-26 2022-02-24 東京エレクトロン株式会社 Coating film removing device, coating film removing method and storage medium
JP7043777B2 (en) 2017-10-04 2022-03-30 東京エレクトロン株式会社 Coating film forming device
JP6659181B2 (en) 2018-06-11 2020-03-04 キヤノン株式会社 Transport apparatus, lithography apparatus, and article manufacturing method

Also Published As

Publication number Publication date
TW202215500A (en) 2022-04-16
WO2022050117A1 (en) 2022-03-10
JP7405268B2 (en) 2023-12-26
KR20230056036A (en) 2023-04-26
CN116018214A (en) 2023-04-25

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