JPWO2022044563A1 - - Google Patents

Info

Publication number
JPWO2022044563A1
JPWO2022044563A1 JP2022545507A JP2022545507A JPWO2022044563A1 JP WO2022044563 A1 JPWO2022044563 A1 JP WO2022044563A1 JP 2022545507 A JP2022545507 A JP 2022545507A JP 2022545507 A JP2022545507 A JP 2022545507A JP WO2022044563 A1 JPWO2022044563 A1 JP WO2022044563A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022545507A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022044563A1 publication Critical patent/JPWO2022044563A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022545507A 2020-08-31 2021-07-08 Pending JPWO2022044563A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020145252 2020-08-31
PCT/JP2021/025873 WO2022044563A1 (ja) 2020-08-31 2021-07-08 実装方法、及び、実装システム

Publications (1)

Publication Number Publication Date
JPWO2022044563A1 true JPWO2022044563A1 (ja) 2022-03-03

Family

ID=80353169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022545507A Pending JPWO2022044563A1 (ja) 2020-08-31 2021-07-08

Country Status (2)

Country Link
JP (1) JPWO2022044563A1 (ja)
WO (1) WO2022044563A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117598037A (zh) * 2022-03-30 2024-02-23 松下知识产权经营株式会社 指示系统、指示方法以及程序

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3170172B2 (ja) * 1995-03-30 2001-05-28 ティーディーケイ株式会社 チップ部品供給装置及び該装置に用いるチップ部品供給ケース
JPH08293697A (ja) * 1995-04-21 1996-11-05 Sony Corp バルクカセット
JPH10335888A (ja) * 1997-06-04 1998-12-18 Juki Corp バルクフィーダーにおけるバルクカセット誤挿入防止方法
JPH1174693A (ja) * 1997-08-27 1999-03-16 Tdk Corp チップ部品供給システム
JP5054616B2 (ja) * 2008-06-02 2012-10-24 太陽誘電株式会社 バルクフィーダ用の部品補充システム

Also Published As

Publication number Publication date
WO2022044563A1 (ja) 2022-03-03

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240510