JPWO2022025123A1 - - Google Patents

Info

Publication number
JPWO2022025123A1
JPWO2022025123A1 JP2022539535A JP2022539535A JPWO2022025123A1 JP WO2022025123 A1 JPWO2022025123 A1 JP WO2022025123A1 JP 2022539535 A JP2022539535 A JP 2022539535A JP 2022539535 A JP2022539535 A JP 2022539535A JP WO2022025123 A1 JPWO2022025123 A1 JP WO2022025123A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022539535A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022025123A1 publication Critical patent/JPWO2022025123A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
JP2022539535A 2020-07-29 2021-07-28 Pending JPWO2022025123A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020128149 2020-07-29
PCT/JP2021/027925 WO2022025123A1 (fr) 2020-07-29 2021-07-28 Composition de résine, objet durci, feuille, stratifié, et carte de circuit imprimé souple

Publications (1)

Publication Number Publication Date
JPWO2022025123A1 true JPWO2022025123A1 (fr) 2022-02-03

Family

ID=80035653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022539535A Pending JPWO2022025123A1 (fr) 2020-07-29 2021-07-28

Country Status (3)

Country Link
JP (1) JPWO2022025123A1 (fr)
TW (1) TW202206501A (fr)
WO (1) WO2022025123A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023189800A1 (fr) * 2022-03-30 2023-10-05 日本ゼオン株式会社 Particules creuses et leur procédé de production
WO2024075744A1 (fr) * 2022-10-05 2024-04-11 株式会社レゾナック Composition de résine ainsi que procédé de fabrication de celle-ci, et objet durci associé

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006218767A (ja) * 2005-02-10 2006-08-24 Kaneka Corp ポリイミド系多層フィルムの製造方法およびその利用
JP6708947B2 (ja) * 2016-01-14 2020-06-10 日立化成株式会社 ミリ波レーダー用印刷配線板製造用樹脂フィルムの製造方法
JP7323314B2 (ja) * 2018-03-28 2023-08-08 積水化学工業株式会社 樹脂材料、積層フィルム及び多層プリント配線板
WO2019188187A1 (fr) * 2018-03-28 2019-10-03 パナソニックＩｐマネジメント株式会社 Composition de résine, et préimprégné, film revêtu de résine, feuille métallique revêtue de résine, stratifié à revêtement métallique, et carte de câblage obtenus chacun à l'aide de ladite composition de résine

Also Published As

Publication number Publication date
TW202206501A (zh) 2022-02-16
WO2022025123A1 (fr) 2022-02-03

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240611