JPWO2022024812A1 - - Google Patents
Info
- Publication number
- JPWO2022024812A1 JPWO2022024812A1 JP2022540186A JP2022540186A JPWO2022024812A1 JP WO2022024812 A1 JPWO2022024812 A1 JP WO2022024812A1 JP 2022540186 A JP2022540186 A JP 2022540186A JP 2022540186 A JP2022540186 A JP 2022540186A JP WO2022024812 A1 JPWO2022024812 A1 JP WO2022024812A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
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- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
- H01L29/0623—Buried supplementary region, e.g. buried guard ring
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- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
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- H01L29/063—Reduced surface field [RESURF] pn-junction structures
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- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
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- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
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- H01L29/1608—Silicon carbide
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41741—Source or drain electrodes for field effect devices for vertical or pseudo-vertical devices
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
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- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
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- H01L29/0843—Source or drain regions of field-effect devices
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- H01L29/42312—Gate electrodes for field effect devices
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- H01L29/4238—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the surface lay-out
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2020131043 | 2020-07-31 | ||
PCT/JP2021/026789 WO2022024812A1 (ja) | 2020-07-31 | 2021-07-16 | SiC半導体装置 |
Publications (1)
Publication Number | Publication Date |
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JPWO2022024812A1 true JPWO2022024812A1 (ja) | 2022-02-03 |
Family
ID=80036403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2022540186A Pending JPWO2022024812A1 (ja) | 2020-07-31 | 2021-07-16 |
Country Status (5)
Country | Link |
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US (1) | US20230170410A1 (ja) |
JP (1) | JPWO2022024812A1 (ja) |
CN (1) | CN115699333A (ja) |
DE (2) | DE212021000196U1 (ja) |
WO (1) | WO2022024812A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024070164A1 (ja) * | 2022-09-29 | 2024-04-04 | ローム株式会社 | 半導体装置 |
WO2024101130A1 (ja) * | 2022-11-08 | 2024-05-16 | ローム株式会社 | 半導体装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3257394B2 (ja) * | 1996-04-04 | 2002-02-18 | 株式会社日立製作所 | 電圧駆動型半導体装置 |
JP5309428B2 (ja) * | 2006-05-01 | 2013-10-09 | 富士電機株式会社 | 半導体装置 |
DE102018112344A1 (de) * | 2017-05-29 | 2018-11-29 | Infineon Technologies Ag | Leistungshalbleitervorrichtung mit dV/dt-Steuerbarkeit und Quergrabenanordnung |
JP6664445B2 (ja) * | 2018-08-10 | 2020-03-13 | ローム株式会社 | SiC半導体装置 |
JP7283753B2 (ja) | 2020-02-25 | 2023-05-30 | 昌秀 神田 | 透明ジグソーパズル |
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2021
- 2021-07-16 DE DE212021000196.3U patent/DE212021000196U1/de active Active
- 2021-07-16 JP JP2022540186A patent/JPWO2022024812A1/ja active Pending
- 2021-07-16 WO PCT/JP2021/026789 patent/WO2022024812A1/ja active Application Filing
- 2021-07-16 US US17/921,144 patent/US20230170410A1/en active Pending
- 2021-07-16 CN CN202180042610.6A patent/CN115699333A/zh active Pending
- 2021-07-16 DE DE112021002151.6T patent/DE112021002151T5/de active Pending
Also Published As
Publication number | Publication date |
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DE212021000196U1 (de) | 2022-01-17 |
CN115699333A (zh) | 2023-02-03 |
US20230170410A1 (en) | 2023-06-01 |
DE112021002151T5 (de) | 2023-01-26 |
WO2022024812A1 (ja) | 2022-02-03 |
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