JPWO2022014411A1 - - Google Patents

Info

Publication number
JPWO2022014411A1
JPWO2022014411A1 JP2022536278A JP2022536278A JPWO2022014411A1 JP WO2022014411 A1 JPWO2022014411 A1 JP WO2022014411A1 JP 2022536278 A JP2022536278 A JP 2022536278A JP 2022536278 A JP2022536278 A JP 2022536278A JP WO2022014411 A1 JPWO2022014411 A1 JP WO2022014411A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022536278A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022014411A1 publication Critical patent/JPWO2022014411A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
JP2022536278A 2020-07-15 2021-07-06 Pending JPWO2022014411A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020121684 2020-07-15
PCT/JP2021/025474 WO2022014411A1 (ja) 2020-07-15 2021-07-06 発光素子用基板

Publications (1)

Publication Number Publication Date
JPWO2022014411A1 true JPWO2022014411A1 (ja) 2022-01-20

Family

ID=79555382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022536278A Pending JPWO2022014411A1 (ja) 2020-07-15 2021-07-06

Country Status (3)

Country Link
JP (1) JPWO2022014411A1 (ja)
TW (1) TW202205701A (ja)
WO (1) WO2022014411A1 (ja)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4699042B2 (ja) * 2005-02-21 2011-06-08 京セラ株式会社 発光素子用配線基板ならびに発光装置
KR101241650B1 (ko) * 2005-10-19 2013-03-08 엘지이노텍 주식회사 엘이디 패키지
JP2010080800A (ja) * 2008-09-29 2010-04-08 Seiko Instruments Inc 発光デバイス及びその製造方法
TWI528508B (zh) * 2008-10-13 2016-04-01 榮創能源科技股份有限公司 高功率發光二極體陶瓷封裝之製造方法
JP2011060859A (ja) * 2009-09-07 2011-03-24 Seiko Instruments Inc 電子部品の製造方法および電子部品
CN102376845A (zh) * 2010-08-17 2012-03-14 展晶科技(深圳)有限公司 发光二极管的封装结构
JP2014041851A (ja) * 2010-12-24 2014-03-06 Asahi Glass Co Ltd 連結基板およびその製造方法、並びに素子基板、発光装置
WO2013002348A1 (ja) * 2011-06-30 2013-01-03 旭硝子株式会社 発光素子用基板および発光装置
JP2013065793A (ja) * 2011-09-20 2013-04-11 Ngk Spark Plug Co Ltd 配線基板
JP6224449B2 (ja) * 2013-12-13 2017-11-01 京セラ株式会社 発光素子搭載用基板およびそれを備えた発光装置
DE102015105470A1 (de) * 2015-04-10 2016-10-13 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauelement und Verfahren zur Herstellung eines lichtemittierenden Bauelements
JP2019114624A (ja) * 2017-12-22 2019-07-11 スタンレー電気株式会社 半導体発光装置及びその製造方法

Also Published As

Publication number Publication date
TW202205701A (zh) 2022-02-01
WO2022014411A1 (ja) 2022-01-20

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