JPWO2022014257A1 - - Google Patents

Info

Publication number
JPWO2022014257A1
JPWO2022014257A1 JP2022536190A JP2022536190A JPWO2022014257A1 JP WO2022014257 A1 JPWO2022014257 A1 JP WO2022014257A1 JP 2022536190 A JP2022536190 A JP 2022536190A JP 2022536190 A JP2022536190 A JP 2022536190A JP WO2022014257 A1 JPWO2022014257 A1 JP WO2022014257A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022536190A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022014257A1 publication Critical patent/JPWO2022014257A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2022536190A 2020-07-17 2021-06-18 Pending JPWO2022014257A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020122732 2020-07-17
PCT/JP2021/023195 WO2022014257A1 (en) 2020-07-17 2021-06-18 Multilayer polyimide film

Publications (1)

Publication Number Publication Date
JPWO2022014257A1 true JPWO2022014257A1 (en) 2022-01-20

Family

ID=79555209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022536190A Pending JPWO2022014257A1 (en) 2020-07-17 2021-06-18

Country Status (5)

Country Link
JP (1) JPWO2022014257A1 (en)
KR (1) KR20230038757A (en)
CN (1) CN116133855A (en)
TW (1) TW202208513A (en)
WO (1) WO2022014257A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114815508B (en) * 2022-06-30 2022-09-23 杭州福斯特应用材料股份有限公司 Photosensitive dry film resist laminate and wiring board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5724468B2 (en) 2011-03-07 2015-05-27 宇部興産株式会社 Method for producing polyimide metal laminate
JP2017179150A (en) * 2016-03-30 2017-10-05 株式会社カネカ Polyimide film
JP2017177604A (en) * 2016-03-30 2017-10-05 株式会社カネカ Polyimide laminate film
JP6691412B2 (en) 2016-03-30 2020-04-28 株式会社カネカ Polyimide film
JP7053208B2 (en) * 2017-09-29 2022-04-12 日鉄ケミカル＆マテリアル株式会社 Polyimide film, metal-clad laminate and circuit board

Also Published As

Publication number Publication date
TW202208513A (en) 2022-03-01
WO2022014257A1 (en) 2022-01-20
CN116133855A (en) 2023-05-16
KR20230038757A (en) 2023-03-21

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240417