JPWO2022014105A1 - - Google Patents

Info

Publication number
JPWO2022014105A1
JPWO2022014105A1 JP2022536134A JP2022536134A JPWO2022014105A1 JP WO2022014105 A1 JPWO2022014105 A1 JP WO2022014105A1 JP 2022536134 A JP2022536134 A JP 2022536134A JP 2022536134 A JP2022536134 A JP 2022536134A JP WO2022014105 A1 JPWO2022014105 A1 JP WO2022014105A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022536134A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022014105A1 publication Critical patent/JPWO2022014105A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Laser Beam Processing (AREA)
JP2022536134A 2020-07-15 2021-03-29 Pending JPWO2022014105A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020121652 2020-07-15
JP2020217758 2020-12-25
PCT/JP2021/013399 WO2022014105A1 (fr) 2020-07-15 2021-03-29 Dispositif de traitement au laser et procédé de traitement au laser

Publications (1)

Publication Number Publication Date
JPWO2022014105A1 true JPWO2022014105A1 (fr) 2022-01-20

Family

ID=79554709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022536134A Pending JPWO2022014105A1 (fr) 2020-07-15 2021-03-29

Country Status (5)

Country Link
JP (1) JPWO2022014105A1 (fr)
KR (1) KR20230037547A (fr)
CN (1) CN116075389A (fr)
TW (1) TW202204077A (fr)
WO (1) WO2022014105A1 (fr)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5775265B2 (ja) * 2009-08-03 2015-09-09 浜松ホトニクス株式会社 レーザ加工方法及び半導体装置の製造方法
JP5456510B2 (ja) 2010-02-23 2014-04-02 株式会社ディスコ レーザ加工装置
KR102000031B1 (ko) * 2010-07-26 2019-07-15 하마마츠 포토닉스 가부시키가이샤 레이저 가공 방법
JP2013089714A (ja) * 2011-10-17 2013-05-13 Disco Abrasive Syst Ltd チップ形成方法
JP5995563B2 (ja) * 2012-07-11 2016-09-21 株式会社ディスコ 光デバイスの加工方法
LT6428B (lt) * 2015-10-02 2017-07-25 Uab "Altechna R&D" Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys
WO2020090905A1 (fr) * 2018-10-30 2020-05-07 浜松ホトニクス株式会社 Dispositif et procédé de traitement laser
JP7120904B2 (ja) * 2018-10-30 2022-08-17 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
KR102248637B1 (ko) 2018-12-07 2021-05-06 임유택 관리기용 폭 조정장치

Also Published As

Publication number Publication date
WO2022014105A1 (fr) 2022-01-20
CN116075389A (zh) 2023-05-05
KR20230037547A (ko) 2023-03-16
TW202204077A (zh) 2022-02-01

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231109