KR20230037547A - 레이저 가공 장치, 및 레이저 가공 방법 - Google Patents
레이저 가공 장치, 및 레이저 가공 방법 Download PDFInfo
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- KR20230037547A KR20230037547A KR1020237000694A KR20237000694A KR20230037547A KR 20230037547 A KR20230037547 A KR 20230037547A KR 1020237000694 A KR1020237000694 A KR 1020237000694A KR 20237000694 A KR20237000694 A KR 20237000694A KR 20230037547 A KR20230037547 A KR 20230037547A
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- laser
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2020-121652 | 2020-07-15 | ||
JP2020121652 | 2020-07-15 | ||
JPJP-P-2020-217758 | 2020-12-25 | ||
JP2020217758 | 2020-12-25 | ||
PCT/JP2021/013399 WO2022014105A1 (fr) | 2020-07-15 | 2021-03-29 | Dispositif de traitement au laser et procédé de traitement au laser |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20230037547A true KR20230037547A (ko) | 2023-03-16 |
Family
ID=79554709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020237000694A KR20230037547A (ko) | 2020-07-15 | 2021-03-29 | 레이저 가공 장치, 및 레이저 가공 방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022014105A1 (fr) |
KR (1) | KR20230037547A (fr) |
CN (1) | CN116075389A (fr) |
TW (1) | TW202204077A (fr) |
WO (1) | WO2022014105A1 (fr) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5456510B2 (ja) | 2010-02-23 | 2014-04-02 | 株式会社ディスコ | レーザ加工装置 |
KR20200069530A (ko) | 2018-12-07 | 2020-06-17 | 임유택 | 관리기용 폭 조정장치 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5775265B2 (ja) * | 2009-08-03 | 2015-09-09 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体装置の製造方法 |
US8961806B2 (en) * | 2010-07-26 | 2015-02-24 | Hamamatsu Photonics K.K. | Laser processing method |
JP2013089714A (ja) * | 2011-10-17 | 2013-05-13 | Disco Abrasive Syst Ltd | チップ形成方法 |
JP5995563B2 (ja) * | 2012-07-11 | 2016-09-21 | 株式会社ディスコ | 光デバイスの加工方法 |
LT6428B (lt) * | 2015-10-02 | 2017-07-25 | Uab "Altechna R&D" | Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys |
WO2020090905A1 (fr) * | 2018-10-30 | 2020-05-07 | 浜松ホトニクス株式会社 | Dispositif et procédé de traitement laser |
JP7285067B2 (ja) * | 2018-10-30 | 2023-06-01 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
-
2021
- 2021-03-29 KR KR1020237000694A patent/KR20230037547A/ko unknown
- 2021-03-29 CN CN202180061227.5A patent/CN116075389A/zh active Pending
- 2021-03-29 JP JP2022536134A patent/JPWO2022014105A1/ja active Pending
- 2021-03-29 WO PCT/JP2021/013399 patent/WO2022014105A1/fr active Application Filing
- 2021-03-30 TW TW110111574A patent/TW202204077A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5456510B2 (ja) | 2010-02-23 | 2014-04-02 | 株式会社ディスコ | レーザ加工装置 |
KR20200069530A (ko) | 2018-12-07 | 2020-06-17 | 임유택 | 관리기용 폭 조정장치 |
Also Published As
Publication number | Publication date |
---|---|
CN116075389A (zh) | 2023-05-05 |
TW202204077A (zh) | 2022-02-01 |
JPWO2022014105A1 (fr) | 2022-01-20 |
WO2022014105A1 (fr) | 2022-01-20 |
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