JPWO2022009990A1 - - Google Patents

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Publication number
JPWO2022009990A1
JPWO2022009990A1 JP2022535406A JP2022535406A JPWO2022009990A1 JP WO2022009990 A1 JPWO2022009990 A1 JP WO2022009990A1 JP 2022535406 A JP2022535406 A JP 2022535406A JP 2022535406 A JP2022535406 A JP 2022535406A JP WO2022009990 A1 JPWO2022009990 A1 JP WO2022009990A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022535406A
Other languages
Japanese (ja)
Other versions
JP7671756B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022009990A1 publication Critical patent/JPWO2022009990A1/ja
Application granted granted Critical
Publication of JP7671756B2 publication Critical patent/JP7671756B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2022535406A 2020-07-09 2021-07-09 研磨用組成物及び研磨方法 Active JP7671756B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020118713 2020-07-09
JP2020118713 2020-07-09
PCT/JP2021/026014 WO2022009990A1 (ja) 2020-07-09 2021-07-09 研磨用組成物及び研磨方法

Publications (2)

Publication Number Publication Date
JPWO2022009990A1 true JPWO2022009990A1 (enrdf_load_html_response) 2022-01-13
JP7671756B2 JP7671756B2 (ja) 2025-05-02

Family

ID=79552564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022535406A Active JP7671756B2 (ja) 2020-07-09 2021-07-09 研磨用組成物及び研磨方法

Country Status (3)

Country Link
JP (1) JP7671756B2 (enrdf_load_html_response)
TW (1) TW202214815A (enrdf_load_html_response)
WO (1) WO2022009990A1 (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024541256A (ja) * 2021-10-27 2024-11-08 インテグリス・インコーポレーテッド 多結晶結晶材料の研磨

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60155359A (ja) * 1984-01-20 1985-08-15 Sumitomo Special Metals Co Ltd セラミツクス材料の無孔化研摩方法
JPH09131662A (ja) * 1995-11-10 1997-05-20 Fuji Elelctrochem Co Ltd セラミックスの研磨方法
JP2003117806A (ja) * 2001-10-10 2003-04-23 Kobe Steel Ltd 多結晶セラミックスの鏡面研磨方法
JP2020029472A (ja) * 2018-08-20 2020-02-27 株式会社ダイセル 多結晶ｙａｇ研磨用スラリー組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60155359A (ja) * 1984-01-20 1985-08-15 Sumitomo Special Metals Co Ltd セラミツクス材料の無孔化研摩方法
JPH09131662A (ja) * 1995-11-10 1997-05-20 Fuji Elelctrochem Co Ltd セラミックスの研磨方法
JP2003117806A (ja) * 2001-10-10 2003-04-23 Kobe Steel Ltd 多結晶セラミックスの鏡面研磨方法
JP2020029472A (ja) * 2018-08-20 2020-02-27 株式会社ダイセル 多結晶ｙａｇ研磨用スラリー組成物

Also Published As

Publication number Publication date
TW202214815A (zh) 2022-04-16
JP7671756B2 (ja) 2025-05-02
WO2022009990A1 (ja) 2022-01-13

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