JPWO2021256516A1 - - Google Patents

Info

Publication number
JPWO2021256516A1
JPWO2021256516A1 JP2022523252A JP2022523252A JPWO2021256516A1 JP WO2021256516 A1 JPWO2021256516 A1 JP WO2021256516A1 JP 2022523252 A JP2022523252 A JP 2022523252A JP 2022523252 A JP2022523252 A JP 2022523252A JP WO2021256516 A1 JPWO2021256516 A1 JP WO2021256516A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022523252A
Other languages
Japanese (ja)
Other versions
JP7136389B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021256516A1 publication Critical patent/JPWO2021256516A1/ja
Priority to JP2022130410A priority Critical patent/JP2022171670A/en
Application granted granted Critical
Publication of JP7136389B2 publication Critical patent/JP7136389B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
JP2022523252A 2020-06-17 2021-06-16 Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate Active JP7136389B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022130410A JP2022171670A (en) 2020-06-17 2022-08-18 Laminate, printed wiring board, semiconductor package and method for producing laminate

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020104375 2020-06-17
JP2020104375 2020-06-17
PCT/JP2021/022910 WO2021256516A1 (en) 2020-06-17 2021-06-16 Laminated board, printed wiring board, semiconductor package, and method for manufacturing laminated board

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022130410A Division JP2022171670A (en) 2020-06-17 2022-08-18 Laminate, printed wiring board, semiconductor package and method for producing laminate

Publications (2)

Publication Number Publication Date
JPWO2021256516A1 true JPWO2021256516A1 (en) 2021-12-23
JP7136389B2 JP7136389B2 (en) 2022-09-13

Family

ID=79268020

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022523252A Active JP7136389B2 (en) 2020-06-17 2021-06-16 Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate
JP2022130410A Pending JP2022171670A (en) 2020-06-17 2022-08-18 Laminate, printed wiring board, semiconductor package and method for producing laminate

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022130410A Pending JP2022171670A (en) 2020-06-17 2022-08-18 Laminate, printed wiring board, semiconductor package and method for producing laminate

Country Status (5)

Country Link
JP (2) JP7136389B2 (en)
KR (1) KR20230025395A (en)
CN (1) CN115835956A (en)
TW (1) TW202212119A (en)
WO (1) WO2021256516A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05261861A (en) * 1992-03-19 1993-10-12 Shin Kobe Electric Mach Co Ltd Laminated sheet
JP2013140907A (en) * 2012-01-06 2013-07-18 Ibiden Co Ltd Printed wiring board and manufacturing method of the same
JP2015076589A (en) * 2013-10-11 2015-04-20 パナソニックＩｐマネジメント株式会社 Laminate sheet
WO2015079820A1 (en) * 2013-11-29 2015-06-04 日東紡績株式会社 Glass fiber fabric-resin composition laminate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740990B2 (en) 1991-11-26 1998-04-15 株式会社日立製作所 Low thermal expansion resin composition for pressure molding
JPWO2013042752A1 (en) * 2011-09-22 2015-03-26 日立化成株式会社 LAMINATE, LAMINATE, MULTILAYER LAMINATE, PRINTED WIRING BOARD AND METHOD FOR PRODUCING LAMINATE
JP6844298B2 (en) * 2017-02-17 2021-03-17 昭和電工マテリアルズ株式会社 Manufacturing method of prepreg, laminated board, printed wiring board, coreless board, semiconductor package and coreless board
CN113195219B (en) * 2018-12-18 2023-09-15 株式会社力森诺科 Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05261861A (en) * 1992-03-19 1993-10-12 Shin Kobe Electric Mach Co Ltd Laminated sheet
JP2013140907A (en) * 2012-01-06 2013-07-18 Ibiden Co Ltd Printed wiring board and manufacturing method of the same
JP2015076589A (en) * 2013-10-11 2015-04-20 パナソニックＩｐマネジメント株式会社 Laminate sheet
WO2015079820A1 (en) * 2013-11-29 2015-06-04 日東紡績株式会社 Glass fiber fabric-resin composition laminate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
南条尚志, 日本複合材料学会誌, vol. 33, no. 4, JPN6022019803, 2007, pages 141 - 149, ISSN: 0004780056 *

Also Published As

Publication number Publication date
WO2021256516A1 (en) 2021-12-23
TW202212119A (en) 2022-04-01
JP7136389B2 (en) 2022-09-13
CN115835956A (en) 2023-03-21
JP2022171670A (en) 2022-11-11
KR20230025395A (en) 2023-02-21

Similar Documents

Publication Publication Date Title
BR112023005462A2 (en)
BR112021014123A2 (en)
BR112023012656A2 (en)
BR112022024743A2 (en)
BR102021018859A2 (en)
BR102021015500A2 (en)
BR112022009896A2 (en)
BR102021007058A2 (en)
BR102020022030A2 (en)
BR112023011738A2 (en)
BR112023016292A2 (en)
BR112023004146A2 (en)
BR112023011539A2 (en)
BR112023011610A2 (en)
BR112023008976A2 (en)
BR112023009656A2 (en)
BR112023006729A2 (en)
BR102021020147A2 (en)
BR102021018926A2 (en)
BR102021018167A2 (en)
BR102021017576A2 (en)
BR102021016837A2 (en)
BR102021016551A2 (en)
BR102021016375A2 (en)
BR102021016200A2 (en)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220418

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20220418

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220524

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220701

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220802

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220815

R151 Written notification of patent or utility model registration

Ref document number: 7136389

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350