JPWO2021246091A1 - - Google Patents
Info
- Publication number
- JPWO2021246091A1 JPWO2021246091A1 JP2022528490A JP2022528490A JPWO2021246091A1 JP WO2021246091 A1 JPWO2021246091 A1 JP WO2021246091A1 JP 2022528490 A JP2022528490 A JP 2022528490A JP 2022528490 A JP2022528490 A JP 2022528490A JP WO2021246091 A1 JPWO2021246091 A1 JP WO2021246091A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020098078 | 2020-06-05 | ||
| JP2020098076 | 2020-06-05 | ||
| JP2020098079 | 2020-06-05 | ||
| JP2020181132 | 2020-10-29 | ||
| PCT/JP2021/016757 WO2021246091A1 (en) | 2020-06-05 | 2021-04-27 | Inspection device, component mounting system, and substrate manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021246091A1 true JPWO2021246091A1 (en) | 2021-12-09 |
| JPWO2021246091A5 JPWO2021246091A5 (en) | 2023-02-17 |
Family
ID=78830842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022528490A Pending JPWO2021246091A1 (en) | 2020-06-05 | 2021-04-27 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2021246091A1 (en) |
| CN (1) | CN115669256A (en) |
| WO (1) | WO2021246091A1 (en) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1662132B (en) * | 2004-02-26 | 2010-08-18 | 欧姆龙株式会社 | Detection method for wrong mounting and substrate detector adopting such method |
| JP2007095764A (en) * | 2005-09-27 | 2007-04-12 | Matsushita Electric Ind Co Ltd | Image recognition apparatus and image recognition method |
| JP4103921B2 (en) * | 2006-08-11 | 2008-06-18 | オムロン株式会社 | Method of setting inspection reference data for fillet inspection, and substrate visual inspection apparatus using this method |
| CN101809403B (en) * | 2007-09-28 | 2011-06-29 | 松下电器产业株式会社 | Inspection device and inspection method |
| CN101925794B (en) * | 2008-01-25 | 2012-08-22 | 松下电器产业株式会社 | Inspection device and inspection method |
| JP6018844B2 (en) * | 2012-08-30 | 2016-11-02 | ヤマハ発動機株式会社 | Component mounting method, component mounting apparatus, and program |
| JP5927504B2 (en) * | 2012-11-30 | 2016-06-01 | パナソニックＩｐマネジメント株式会社 | Component mounting system and component mounting method |
| JP6047760B2 (en) * | 2013-11-20 | 2016-12-21 | パナソニックＩｐマネジメント株式会社 | Component mounting system and component mounting method |
| JP6277423B2 (en) * | 2014-09-11 | 2018-02-14 | パナソニックＩｐマネジメント株式会社 | Component mounting method and component mounting system |
| WO2017187527A1 (en) * | 2016-04-26 | 2017-11-02 | 富士機械製造株式会社 | Substrate work machine |
| JP6748846B2 (en) * | 2016-08-31 | 2020-09-02 | パナソニックＩｐマネジメント株式会社 | Component mounting system, data feedback method in component mounting system, and program for executing data feedback method in component mounting system |
| JP6913851B2 (en) * | 2017-08-24 | 2021-08-04 | パナソニックＩｐマネジメント株式会社 | Mounting board manufacturing system and mounting board manufacturing method |
| JP7042392B2 (en) * | 2017-08-24 | 2022-03-28 | パナソニックＩｐマネジメント株式会社 | Mounting board manufacturing system and mounting board manufacturing method |
-
2021
- 2021-04-27 JP JP2022528490A patent/JPWO2021246091A1/ja active Pending
- 2021-04-27 WO PCT/JP2021/016757 patent/WO2021246091A1/en active Application Filing
- 2021-04-27 CN CN202180039366.8A patent/CN115669256A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN115669256A (en) | 2023-01-31 |
| WO2021246091A1 (en) | 2021-12-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221020 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20240213 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20240222 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240314 |