JPWO2021230002A1 - - Google Patents

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Publication number
JPWO2021230002A1
JPWO2021230002A1 JP2022521782A JP2022521782A JPWO2021230002A1 JP WO2021230002 A1 JPWO2021230002 A1 JP WO2021230002A1 JP 2022521782 A JP2022521782 A JP 2022521782A JP 2022521782 A JP2022521782 A JP 2022521782A JP WO2021230002 A1 JPWO2021230002 A1 JP WO2021230002A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022521782A
Other languages
Japanese (ja)
Other versions
JP7440626B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021230002A1 publication Critical patent/JPWO2021230002A1/ja
Application granted granted Critical
Publication of JP7440626B2 publication Critical patent/JP7440626B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D251/00—Heterocyclic compounds containing 1,3,5-triazine rings
    • C07D251/02—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings
    • C07D251/12—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members
    • C07D251/26—Heterocyclic compounds containing 1,3,5-triazine rings not condensed with other rings having three double bonds between ring members or between ring members and non-ring members with only hetero atoms directly attached to ring carbon atoms
    • C07D251/40—Nitrogen atoms
    • C07D251/54—Three nitrogen atoms
    • C07D251/70—Other substituted melamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022521782A 2020-05-15 2021-04-16 Curable compositions, thermally conductive materials, thermally conductive sheets, devices with thermally conductive layers, compounds Active JP7440626B2 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2020085905 2020-05-15
JP2020085905 2020-05-15
JP2020116956 2020-07-07
JP2020116956 2020-07-07
JP2020146996 2020-09-01
JP2020146996 2020-09-01
PCT/JP2021/015744 WO2021230002A1 (en) 2020-05-15 2021-04-16 Curable composition, thermally conductive material, thermally conductive sheet, device with thermally conductive layer, and compound

Publications (2)

Publication Number Publication Date
JPWO2021230002A1 true JPWO2021230002A1 (en) 2021-11-18
JP7440626B2 JP7440626B2 (en) 2024-02-28

Family

ID=78525673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022521782A Active JP7440626B2 (en) 2020-05-15 2021-04-16 Curable compositions, thermally conductive materials, thermally conductive sheets, devices with thermally conductive layers, compounds

Country Status (3)

Country Link
JP (1) JP7440626B2 (en)
TW (1) TW202144449A (en)
WO (1) WO2021230002A1 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09227432A (en) * 1996-02-23 1997-09-02 Honshu Chem Ind Co Ltd New tetrakisphenol compound
JP2003502412A (en) * 1999-06-23 2003-01-21 パーカー ヒューズ インスティテュート Melamine derivatives as potent anticancer agents
JP2010095645A (en) * 2008-10-17 2010-04-30 Hitachi Chem Co Ltd Epoxy resin composition having low coefficient of thermal expansion
JP2010254951A (en) * 2009-03-31 2010-11-11 Hitachi Chem Co Ltd Liquid resin composition for electronic part, and electronic part device
JP2011500751A (en) * 2007-10-25 2011-01-06 ロレアル S-triazine derivatives containing at least two specific silaneaminobenzoate or silaneaminobenzamide groups; photoprotective cosmetic compositions containing these derivatives; use of said S-triazine derivatives
WO2019017053A1 (en) * 2017-07-19 2019-01-24 京セラ株式会社 Resin composition for sealing sheet, sealing sheet and semiconductor device
WO2019054707A1 (en) * 2017-09-13 2019-03-21 주식회사 트리엘 Novel triazine derivative and photosensitive composition comprising same
WO2019203292A1 (en) * 2018-04-20 2019-10-24 三菱瓦斯化学株式会社 Thermal curing composition, prepreg, laminate, metal-foil-clad laminate, printed circuit board, and multi-layer printed circuit board
WO2019240079A1 (en) * 2018-06-12 2019-12-19 日立化成株式会社 Curable resin composition and electronic component device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09227432A (en) * 1996-02-23 1997-09-02 Honshu Chem Ind Co Ltd New tetrakisphenol compound
JP2003502412A (en) * 1999-06-23 2003-01-21 パーカー ヒューズ インスティテュート Melamine derivatives as potent anticancer agents
JP2011500751A (en) * 2007-10-25 2011-01-06 ロレアル S-triazine derivatives containing at least two specific silaneaminobenzoate or silaneaminobenzamide groups; photoprotective cosmetic compositions containing these derivatives; use of said S-triazine derivatives
JP2010095645A (en) * 2008-10-17 2010-04-30 Hitachi Chem Co Ltd Epoxy resin composition having low coefficient of thermal expansion
JP2010254951A (en) * 2009-03-31 2010-11-11 Hitachi Chem Co Ltd Liquid resin composition for electronic part, and electronic part device
WO2019017053A1 (en) * 2017-07-19 2019-01-24 京セラ株式会社 Resin composition for sealing sheet, sealing sheet and semiconductor device
WO2019054707A1 (en) * 2017-09-13 2019-03-21 주식회사 트리엘 Novel triazine derivative and photosensitive composition comprising same
WO2019203292A1 (en) * 2018-04-20 2019-10-24 三菱瓦斯化学株式会社 Thermal curing composition, prepreg, laminate, metal-foil-clad laminate, printed circuit board, and multi-layer printed circuit board
WO2019240079A1 (en) * 2018-06-12 2019-12-19 日立化成株式会社 Curable resin composition and electronic component device

Also Published As

Publication number Publication date
WO2021230002A1 (en) 2021-11-18
TW202144449A (en) 2021-12-01
JP7440626B2 (en) 2024-02-28

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