JPWO2021220726A1 - - Google Patents
Info
- Publication number
- JPWO2021220726A1 JPWO2021220726A1 JP2022517579A JP2022517579A JPWO2021220726A1 JP WO2021220726 A1 JPWO2021220726 A1 JP WO2021220726A1 JP 2022517579 A JP2022517579 A JP 2022517579A JP 2022517579 A JP2022517579 A JP 2022517579A JP WO2021220726 A1 JPWO2021220726 A1 JP WO2021220726A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020080703 | 2020-04-30 | ||
JP2020080704 | 2020-04-30 | ||
PCT/JP2021/014470 WO2021220726A1 (en) | 2020-04-30 | 2021-04-05 | Epoxy resin composition for sealing, electronic part device, and method for manufacturing same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021220726A1 true JPWO2021220726A1 (en) | 2021-11-04 |
Family
ID=78332366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022517579A Pending JPWO2021220726A1 (en) | 2020-04-30 | 2021-04-05 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2021220726A1 (en) |
CN (1) | CN115461406A (en) |
TW (1) | TW202143409A (en) |
WO (1) | WO2021220726A1 (en) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006104393A (en) * | 2004-10-07 | 2006-04-20 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP5251392B2 (en) * | 2007-10-01 | 2013-07-31 | 日立化成株式会社 | Epoxy resin molding material for sealing and electronic component device |
JP6507506B2 (en) * | 2014-07-16 | 2019-05-08 | 住友ベークライト株式会社 | Resin composition for sealing and semiconductor device |
JP6370836B2 (en) * | 2015-06-04 | 2018-08-08 | 四国化成工業株式会社 | Surface treatment agent, resin composition and use thereof |
WO2018043035A1 (en) * | 2016-08-30 | 2018-03-08 | リンテック株式会社 | Resin composition, resinous sheet, and semiconductor device |
JP2019167407A (en) * | 2018-03-22 | 2019-10-03 | 日立化成株式会社 | Epoxy resin composition, and electronic component device |
JP2019172911A (en) * | 2018-03-29 | 2019-10-10 | 京セラ株式会社 | Resin composition and semiconductor device |
JP7302598B2 (en) * | 2018-06-12 | 2023-07-04 | 株式会社レゾナック | Curable resin composition and electronic component device |
JPWO2019240083A1 (en) * | 2018-06-12 | 2021-05-06 | 積水化学工業株式会社 | Resin material and multi-layer printed wiring board |
-
2021
- 2021-04-05 WO PCT/JP2021/014470 patent/WO2021220726A1/en active Application Filing
- 2021-04-05 JP JP2022517579A patent/JPWO2021220726A1/ja active Pending
- 2021-04-05 CN CN202180031715.1A patent/CN115461406A/en active Pending
- 2021-04-15 TW TW110113487A patent/TW202143409A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN115461406A (en) | 2022-12-09 |
TW202143409A (en) | 2021-11-16 |
WO2021220726A1 (en) | 2021-11-04 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240209 |